Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object

ABSTRACT

A three dimensional mold object manufacturing apparatus manufactures a three dimensional mold object by repeatedly layering layers using a composition including particles. The apparatus includes a layer forming section configured to form the layers using the composition, a binding liquid applying unit configured to apply binding liquid for bonding the particles, an infrared ray irradiating unit configured to cure the binding liquid, and a bulge detecting unit configured to detect a bulge on the layers. The layer forming section and the infrared ray irradiating unit are configured to move in the same direction. When the bulge detecting unit detects the bulge with a height equal to or more than a predetermined height formed on one of the layers, the layer forming section is configured to adjust a thickness of a subsequent one of the layers, which is provided directly on the one of the layers where the bulge is detected.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. patent application Ser. No.14/557,638, which claims priority to Japanese Patent Application No.2013-254768 filed on Dec. 10, 2014. The entire disclosures of U.S.patent application Ser. No. 14/557,638 and Japanese Patent ApplicationNo. 2013-254768 are hereby incorporated herein by reference.

BACKGROUND Technical Field

The present invention relates to a three dimensional mold objectmanufacturing apparatus, a method for manufacturing a three dimensionalmold object, and a three dimensional mold object.

Related Art

A technique is known where a three dimensional mold object is molded byforming a powder layer (a unit layer) using particles and the powderlayers are layered. With this technique, the three dimensional moldobject is molded by the following operations being repeated. First, apowder layer is formed by thinly laying powder with a uniform thicknessand the powder is selectively bonded only at desired portions of thepowder layer. As a result, a member with a thin plate shape (referred tobelow as a “cross sectional member”) is formed at a portion where thepowder is bonded to itself. After this, on this powder layer, anotherpowder layer is thinly formed and the powder is selectively bonded onlyat desired portions. As a result, a new cross sectional member is formedwith the powder layer which is newly formed. At this time, the crosssectional member which is newly formed is also bonded with the crosssectional member which was previously formed. By repeating theseoperations, it is possible to form a three dimensional mold object bylayering the cross sectional members with the thin plate shape one layerat a time.

There are problems with this technique such as that, since the powderlayer with a smaller thickness (for example, a powder layer with athickness of several hundred μm or less) is formed using the powder,dimensional precision of the three dimensional mold object which isobtained is reduced and significant defects are generated such asmissing portions or the like in the three dimensional mold object whichis obtained in a case where there are bulges due to foreign matter orthe like on the powder layer even when the size of the three dimensionalmold object is relatively small.

In order to solve this problem, a method is proposed where bulges areremoved using a processing means (a removing means) which is providedwith a milling head (for example, refer to Japanese Unexamined PatentApplication Publication No. 2004-277881). However, productivity of thethree dimensional mold object is reduced due to this method. Inparticular, in a case where there are numerous bulges, productivity ofthe three dimensional mold object is remarkably reduced since it isnecessary for the bulges to be removed individually. In addition, it isnecessary to carry out planarizing again since removing of the bulges isaccompanied with disturbing of the layer and this is a further cause ofproductivity of the three dimensional mold object being reduced.

SUMMARY

The object of the present invention is to provide a three dimensionalmold object manufacturing apparatus where it is possible to effectivelymanufacture a three dimensional mold object with superior dimensionalprecision where defects are effectively prevented from being generated,to provide a method for manufacturing a three dimensional mold objectwhere it is possible to effectively manufacture a three dimensional moldobject with superior dimensional precision where defects are effectivelyprevented from being generated, and to provide a three dimensional moldobject which is manufactured using the three dimensional mold objectmanufacturing apparatus or the method for manufacturing a threedimensional mold object.

This object is achieved using the aspects described below.

A three dimensional mold object manufacturing apparatus is adapted tomanufacture a three dimensional mold object by repeatedly forming andlayering layers using a composition including particles. The threedimensional mold object manufacturing apparatus includes a layer formingsection, a binding liquid applying unit, an infrared ray irradiatingunit, and a bulge detecting unit. The layer forming section isconfigured and arranged to form the layers using the composition. Thebinding liquid applying unit is configured and arranged to apply bindingliquid for bonding the particles. The infrared ray irradiating unit isconfigured and arranged to cure the binding liquid. The bulge detectingunit is configured and arranged to detect a bulge on the layers. Thelayer forming section and the infrared ray irradiating unit areconfigured and arranged to move in the same direction. When the bulgedetecting unit detects the bulge with a height equal to or more than apredetermined height formed on one of the layers, the layer formingsection is configured and arranged to adjust a thickness of a subsequentone of the layers, which is provided directly on the one of the layerswhere the bulge is detected.

In the three dimensional mold object manufacturing apparatus of theaspect, the layer forming section preferably has a raising and loweringstage and a planarizing unit configured and arranged to be relativelymoved with respect to the raising and lowering stage and to planarizethe composition which is applied to form the layers, and the layerforming section is preferably configured and arranged to adjust thethickness of the subsequent one of the layers by adjusting a loweringamount of the raising and lowering stage.

In the three dimensional mold object manufacturing apparatus of theaspect, the layer forming section is preferably configured and arrangedto form the subsequent one of the layers with a standard thickness whenthe bulge detecting unit does not detect the bulge on the one of thelayers with the height equal to or more than the predetermined height,and the layer forming section is preferably configured to form thesubsequent one of the layers with a thickness where a value, which isdetermined based on a largest height out of heights of bulges, is addedto the standard thickness when the bulge detecting unit detects one ormore of the bulges with the height equal to or more than thepredetermined height.

In the three dimensional mold object manufacturing apparatus of theaspect, when the largest height out of the heights of the bulges is Y(μm), the layer forming section is preferably configured and arranged todetermine the thickness of the subsequent one of the layers in a rangewhich is 1.05×Y or more and 1.5×Y or less when the bulge detecting unitdetects one or more of the bulges with the height equal to or more thanthe predetermined height.

In the three dimensional mold object manufacturing apparatus of theaspect, the binding liquid applying unit is preferably configured andarranged to adjust a discharge amount of the binding liquid based on thethickness of the subsequent one of the layers where the thickness isadjusted due to detecting of the bulge.

In the three dimensional mold object manufacturing apparatus of theaspect, the composition preferably includes a volatile solvent and awater soluble resin in addition to the particles.

In the three dimensional mold object manufacturing apparatus of theaspect, the infrared ray irradiating unit is preferably configured andarranged to adjust output of the infrared rays based on the thickness ofthe subsequent one of the layers where the thickness is adjusted due todetecting of the bulge.

In the three dimensional mold object manufacturing apparatus of theaspect, the bulge detecting section preferably has a sensor configuredand arranged to be relatively moved with respect to the layers.

In the three dimensional mold object manufacturing apparatus of theaspect, the bulge detecting section preferably has a sensor which isarranged so as to not relatively move with respect to the layers.

In the three dimensional mold object manufacturing apparatus of theaspect, it is preferable that the bulge detecting unit is preferablyconfigured and arranged to determine the height of the bulge bydetermining a focal point distance from above a main surface of the oneof the layers.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the attached drawings which form a part of thisoriginal disclosure:

FIGS. 1A to 1E are cross sectional diagrams schematically illustratingeach process in an embodiment of a method for manufacturing a threedimensional mold object of the present embodiment.

FIGS. 2A to 2D are cross sectional diagrams schematically illustratingeach process in an embodiment of a method for manufacturing a threedimensional mold object of the present embodiment.

FIG. 3 is a cross sectional diagram schematically illustrating anembodiment of a three dimensional mold object manufacturing apparatus ofthe present embodiment.

FIG. 4 is a planar diagram for explaining the positional relationshipbetween a layer forming section and a bulge detecting unit in the threedimensional mold object manufacturing apparatus shown in FIG. 3.

FIG. 5 is a cross sectional diagram schematically illustrating anotherembodiment of a three dimensional mold object manufacturing apparatus ofthe present embodiment.

FIG. 6 is a planar diagram for explaining the positional relationshipbetween a layer forming section and a bulge detecting unit in the threedimensional mold object manufacturing apparatus shown in FIG. 5.

FIG. 7 is a cross sectional diagram schematically illustrating anotherembodiment of a three dimensional mold object manufacturing apparatus ofthe present embodiment.

FIG. 8 is a cross sectional diagram schematically illustrating a statein a layer (a three dimensional mold object) immediately before acomposition applying process.

FIG. 9 is a cross sectional diagram schematically illustrating a statewhere particles are bonded together using a binding agent which ishydrophobic.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiment of the present invention will be described in detail belowwith reference to the attached diagrams.

Method for Manufacturing Three Dimensional Mold Object

A method for manufacturing a three dimensional mold object of thepresent embodiment will be described first.

FIG. 1 and FIG. 2 are cross sectional diagrams schematicallyillustrating each process in an embodiment of a method for manufacturinga three dimensional mold object of the present embodiment.

As shown in FIGS. 1A to 1E and FIGS. 2A to 2D, the manufacturing methodof the present embodiment has a layer forming process (1A and 1E) offorming a layer 1 with a predetermined thickness using a composition 11which includes particles 111, a binding liquid applying process (1B and2A) of applying a binding liquid 12 with regard to the layer 1 using anink jet system, and a curing process (a bonding process) (1C and 2B) ofcuring a bonding agent 121 which is included in the binding liquid 12which is applied to the layer 1 and forming a cured section (a bondedsection) 13 in the layer 1 by bonding the particles 111, these processesare repeatedly performed in this order, and furthermore, after this, hasa unbonded particles removing process (2D) of removing the particles IIIwhich are not bonded using the bonding agent 121 out of the particles111 which configure each of the layers 1.

Then, prior to the second of the layer forming processes, a scanningprocess (1D) of checking for the presence or absence of bulges 9 with aheight which is equal to or higher than a predetermined height isperformed with regard to the layer 1 which is formed in the previousprocess (the layer where the bonded section is formed). That is, whenany of a plurality of the layers 1 is a first layer, a process forforming the first layer is a first layer forming process, the layer 1which is formed directly on the first layer is a second layer, and theprocess for forming the second layer is a second layer forming process,there is the scanning process of checking the presence or absence of abulge with a height which is equal to or higher than a predeterminedheight on the first layer between the first layer forming process andthe second layer forming process.

Then, in a case where the bulge 9 with a height which is equal to orhigher than a predetermined height is detected in the scanning process,the thickness of the layer 1 (the second layer) is adjusted in thelatter of the layer forming processes (the second layer forming process)based on the height of the bulge 9.

In this manner, in a case where the bulge 9 with a height which is equalto or higher than a predetermined height is detected on the layer 1 (thefirst layer) which is already formed, it is possible for disturbance ofthe layer 1 which is formed (the second layer) to be effectivelyprevented from being generated (for example, disturbance of the layer 1due to the bulge 9 and a planarizing unit which forms the layer 1 cominginto contact or the like) due to there being the bulge 9, for a threedimensional mold object 10 which is obtained as a final product to havesuperior dimensional precision, and for defects to be effectivelyprevented from being generated, when the layer 1 (the second layer) isformed by adjusting the thickness of the layer 1 (the second layer)which is formed afterwards based on the height of the bulge 9. Inaddition, since it is possible to form the layer 1 (the second layer)without removing the bulge 9, it is possible for the three dimensionalmold object to have superior productivity.

Here, the thickness of the layer 1 which is to be formed (the secondlayer) need not be changed in the latter of the layer forming processes(the second layer forming process) in a case where the bulge 9 with aheight which is equal to or higher than the predetermined height is notdetected in the scanning process (in a case where the bulge 9 is notdetected or in a case where the bulge 9 is detected but the height ofthe bulge 9 is lower than the predetermined height).

In addition, in the present embodiment, the terms of the “first layer”and the “second layer” indicate a relative relationship between any twolayers out of the plurality of layers which configure the threedimensional mold object. In more detail, in a relationship where thescanning process is performed for an n^(th) layer of the layer 1, then^(th) layer of the layer 1 is the “first layer” and an n+1^(th) layerof the layer 1 is the “second layer”, and in a relationship where thescanning process is performed for the n+1^(th) layer of the layer 1which follows, the n+1^(th) layer of the layer 1 is the “first layer”and an n+2^(th) layer of the layer 1 is the “second layer”.

Each of the process will be described below.

Layer Forming Process

First, the layer 1 is formed with a predetermined thickness on a stage41 using the composition (a three dimensional molding composition) 11which includes the particles 111 (1A).

Here, the composition 11 will be described later.

In this process, the layer 1 is formed by the surface being planarizedusing the planarizing unit.

In the first of the layer forming processes, the layer 1 is formed witha thickness which is set in advance (a standard thickness T₀) (1A).

The standard thickness T₀ is not particularly limited, but the standardthickness T₀ is, for example, preferably 30 μm or more and 500 μm orless and is more preferably 70 μm or more and 150 μm or less. Due tothis, it is possible for the three dimensional mold object 10 to havesufficiently superior productivity, for unintentional irregularities andthe like to be more effectively prevented from being generated in thethree dimensional mold object 10 which is manufactured, and for thethree dimensional mold object 10 to have particularly superiordimensional precision.

In addition, in the second time onward of the layer forming processes(refer to 1 e), the thickness of the layer 1 which is formed (the secondlayer) is as followed. That is, in the second time onward of the layerforming processes, the layer 1 (the second layer) is formed with thestandard thickness T₀ which is set in advance in a case where the bulge9 with a height which is equal to or higher than the predeterminedheight is not detected in the scanning process in the layer 1 (the firstlayer) which is already formed (in a case where the bulge 9 is notdetected or in a case where the bulge 9 is detected but the height ofthe bulge 9 is lower than the predetermined height). In contrast tothis, in the latter of the layer forming processes (the second layerforming process) in a case where one or more of the bulges 9 with aheight which is equal to or higher than the predetermined height isdetected in the layer 1 which is already formed (the first layer), thelayer 1 (the second layer) is formed by adjusting the thickness based onthe height of the bulge 9 (the largest height in the case where thereare a plurality of the bulges 9) (refer to 1 e). That is, the layer 1(the second layer) is formed with a thickness which is larger than thestandard thickness T₀. Due to this, it is possible to more effectivelyprevent defects from being generated in the three dimensional moldobject 10 which is manufactured and it is possible for the threedimensional mold object 10 to have particularly superior dimensionalprecision.

The thickness of the layer 1 after adjusting (the thickness of thesecond layer) is not particularly limited in a case where one or more ofthe bulges 9 with a height which is equal to or higher than thepredetermined height is detected in the previous scanning process, butwhen, for example, the largest height out of the heights of the bulges 9which is detected in the previous scanning process is Y (μm), thethickness of the layer 1 (the second layer) is preferably 1.05 Y or moreand 1.5 Y or less, is more preferably 1.10 Y or more and 1.40 Y or less,and even more preferably 1.15 Y or more and 1.35 Y or less. Due to this,it is possible to more effectively prevent defects from being generatedin the three dimensional mold object 10 which is manufactured and it ispossible for the three dimensional mold object 10 to have more superiordimensional precision.

Here, the thickness of the second layer, in a case where one or more ofthe bulges 9 with a height which is equal to or higher than thepredetermined height is detected in the previous scanning process, maybe a variable value (for example, a value where a proportionalrelationship is established) according to the height of the bulge 9 witha height which is equal to or higher than the predetermined height whichis detected in the first layer or may be a fixed value irrespective ofthe specific height of the bulge 9 which is detected in the first layer.

Binding Liquid Applying Process

After the layer 1 is formed in the layer forming process, the bindingliquid 12 for bonding the particles 111 which configure the layer 1 isapplied with regard to the layer 1 using an ink jet system (1B and 2A).

In this process, the binding liquid 12 is selectively applied only toportions of the layer 1 which correspond to actual sections (portionswhich are to be solid) of the three dimensional mold object 10.

Due to this, it is possible to strongly bond together the particles 111which configure the layer 1 and to form the cured section (bondedsection) 13 with a desired shape as a final product. In addition, it ispossible for the three dimensional mold object 10 which is obtained as afinal product to have superior mechanical strength.

In this process, it is possible to apply the binding liquid 12 withfavorable reproduction even when patterns for applying the bindingliquid 12 are fine shapes since the binding liquid 12 is applied usingan ink jet system. As a result, it is possible for the dimensionalprecision of the three dimensional mold object 10 which is obtained as afinal product to be particularly high.

In addition, in a case where the thickness of the layer 1, where thebinding liquid 12 is to be applied in this process, is adjusted to athickness which is larger than the standard thickness T₀, the amount ofthe binding liquid 12 to be applied in this process is adjusted based onthe thickness of the layer 1 (in proportion to the standard thicknessT₀) (refer to 2A). Due to this, it is possible to apply the bindingliquid 12 in an amount which is necessarily sufficient and it ispossible to reliably form the bonded section 13 in the desired pattern.In addition, it is possible to reliably obtain the desired color tone ina case where a coloring agent is included in the binding liquid 12 andit is possible to reliably prevent unintentional changes in color toneand unintentional breakdown of the color balance in accompaniment withchanges in the thickness of the layer 1.

Here, the binding liquid 12 will be described later.

Curing Process (Bonding Process)

After applying of the binding liquid 12 to the layer 1 in the bindingliquid applying process, the bonding agent 121, which is included in thebinding liquid 12 which is applied to the layer 1, is cured and thecured section (the bonded section) 13 is formed (1C and 2B). Due tothis, it is possible to have particular superior bonding strengthbetween the bonding agent 121 and the particles 111, and as a result, itis possible for the three dimensional mold object 10 which is obtainedas a final product to have particular superior mechanical strength.

This process differs depending on the type of the bonding agent 121,but, for example, it is possible to be performed by heating in a casewhere the bonding agent 121 is a thermosetting resin and it is possibleto be performed by irradiating with corresponding light in a case wherethe bonding agent 121 is a photo-curable resin (for example, it ispossible to be performed by irradiating ultraviolet rays in a case wherethe bonding agent 121 is an ultraviolet ray curable resin).

Here, the binding liquid applying process and the curing process may beperformed so as to progress at the same time. That is, a curing reactionmay progress sequentially from a portion where the binding liquid 12 isapplied before the whole pattern of the entirety of one of the layers 1is formed.

In addition, it is possible for this process to be omitted in a casewhere, for example, the bonding agent 121 does not have a curablecomponent. In this case, the binding liquid applying process describedabove may also act as the bonding process.

Scanning Process

In the scanning process, there is checking for the presence or absenceof the bulge 9 with a height which is equal to or more than thepredetermined height on the layer 1 (the first layer) where the bondedsection 13 is formed (1D).

Here, it is possible for the “predetermined height” to be set based onthe possibility that a defect (disturbing of the surface or the like)will be generated in the layer 1 (the second layer) in a case where thelayer 1 which is new (the second layer) is formed with the standardthickness T₀ on the layer 1 (the first layer) where the bonded section13 is formed.

Then, it is possible for the “predetermined height” to be set based on,for example, the standard thickness T₀, the particles diameter of theparticles 111, or the like.

For example, it is possible for the “predetermined height” to be 0.5 T₀(μm) or more and 2 T₀ (μm) or less with regard to the standard thicknessT₀.

In addition, when the average particle diameter of the particles 111 isD (μm), it is possible for the “predetermined height” to be, forexample, 0.5 D (μm) or more and 2 D (μm) or less. Here, the averageparticle diameter in the present embodiment refers to the volume averageparticle diameter and it is possible to determine by, for example,adding methanol to a sample and measuring a dispersion liquid, which isdispersed for three minutes using an ultrasonic dispersing unit, with aCoulter counter type of particle size distribution measuring unit (typeTA-II manufactured by Coulter Electronics Inc.) with an aperture of 50μm.

In particular, by performing the scanning process with regard to thefirst layer after the bonding process with regard to the first layer(and immediately before performing the second layer forming process) inthe present embodiment, it is possible to more effective prevent theshape of the bulge 9 changing and the bulges 9 newly forming due toforeign matter and the like which is new before the second layer formingprocess, and it is possible to form the layer 1 (the second layer) witha more appropriate thickness in the second layer forming process.

In addition to foreign matter which is not originally assumed to beincluded as a configuring component of the three dimensional moldobject, the bulge 9 also includes the composition 11 as a source (inparticular, the particles 111 as a source).

Here, it is sufficient if the bulges 9 with a height which is equal toor more than the predetermined height are detected in the scanningprocess and detecting need not be performed for, for example, the bulges9 with a height which is equal to or less than a threshold.

The series of processes described above are repeatedly performed. Due tothis, there is a state where the particles 111 are bonded in portionswhere the binding liquid 12 are applied out of each of the layers 1 andthe three dimensional mold object 10, which is a layered body where aplurality of the layers 1 are layered in this state, is obtained (referto 2C).

In addition, the binding liquid 12, which is applied to the layer 1 inthe second time onward of the binding liquid applying processes (referto 1D), is used to bond together the particles 111 which configure thelayer 1, and a portion of the binding liquid 12 which is appliedpenetrates beneath the layer 1. For this reason, the binding liquid 12is used to not only bond together the particles 111 in each of thelayers 1 but to bond together the particles 111 between adjacent layers.As a result, the three dimensional mold object 10 which is obtained as afinal product has superior overall mechanical strength.

Here, the scanning process is not performed with the layer 1 which isformed last in the present embodiment.

Unbonded Particles Removing Process

Then, the unbonded particles removing process (2D) of removing theparticles 111 which are not bonded using the bonding agent 121 (theunbonded particles) out of the particles 111 which configure each of thelayers 1 is performed in a post-processing process after the series ofprocess as described above is repeatedly performed. Due to this, thethree dimensional mold object 10 is taken out.

As the detail method of this process, there are the examples of, forexample, a method of wiping away the unbonded particles using a brush orthe like, a method of removing the unbonded particles using suction, amethod of blowing a gas such as air, a method of applying a liquid suchas water (for example, a method of immersing the layered body which isobtained as above in a liquid, a method of blowing a liquid, or thelike), a method of applying vibration using ultrasonic vibration or thelike, and the like. In addition, it is possible to perform a combinationof any two or more types of methods which are selected from above. Inmore detail, there are the examples of a method of immersing in a liquidsuch as water after blowing a gas such as air, a method of applyingultrasonic vibration in a state of being immersed in a liquid such aswater. Among these, it is preferable that a method is adopted where aliquid which includes water is applied with regard to the layered bodywhich is obtained as described above (in particular, a method ofimmersing in a liquid which includes water).

In the description above, forming of the bonded section is described asbeing performing using the binding liquid, but forming of the bondedsection may be performed using any method in the manufacturing method ofthe present embodiment and may be performed, for example, by fusing(sintering and joining) the particles 111 by irradiating energy rays. Ina case where forming of the bonded section is performed using thismethod in the prior art, it is particularly easy for unintentionalbulges to be formed and it is difficult to obtain the three dimensionalmold object with superior dimensional precision where defects areeffectively prevented from being generated. In addition, in this method,removing the bulge is considered, but productivity of the threedimensional mold object is remarkable reduced in this case. In addition,the bulge which are generated in this method are often fused (sintered)due to irradiating of energy rays and it is easy for defects to begenerated in the bonded section which accompanies removing the bulgessince a relatively large force is necessary for removing the bulges. Incontrast to this, it is possible to effectively prevent the problemsdescribed above from being generated in the present embodiment even in acase where forming of the bonded section is performed by fusing(sintering and joining) the particles due to irradiating of energy rays.That is, the effects of the present embodiment are more remarkableexhibited in a case where forming of the bonded section is performed byfusing (sintering and joining) the particles due to irradiating ofenergy rays.

According to the manufacturing method of the present embodiment asdescribed above, it is possible to effectively manufacture the threedimensional mold object with superior dimensional precision wheredefects are effectively prevented from being generated. In particular,it is possible for the three dimensional mold object to have superiorproductivity in the present embodiment since removing of the bulges anda layer re-planarizing process (a planarizing process for alleviatingand eliminating disturbance to the layer which accompanies removing ofthe bulge) are not necessary. In addition, increasing of the time whichis necessary for manufacturing the three dimensional mold object iseffectively prevented in a case where the size of the bulge is large andin a case where the number of the bulges is large.

Three Dimensional Mold Object Manufacturing Apparatus

A three dimensional mold object manufacturing apparatus of the presentembodiment will be described first.

FIG. 3 is a cross sectional diagram schematically illustrating anembodiment of the three dimensional mold object manufacturing apparatusof the present embodiment, FIG. 4 is a planar diagram for explaining thepositional relationship between the layer forming section and the bulgedetecting unit in the three dimensional mold object manufacturingapparatus shown in FIG. 3, FIG. 5 is a cross sectional diagramschematically illustrating another embodiment of the three dimensionalmold object manufacturing apparatus of the present embodiment, FIG. 6 isa planar diagram for explaining the positional relationship between thelayer forming section and the bulge detecting unit in the threedimensional mold object manufacturing apparatus shown in FIG. 5, andFIG. 7 is a cross sectional diagram schematically illustrating anotherembodiment of the three dimensional mold object manufacturing apparatusof the present embodiment.

A three dimensional mold object manufacturing apparatus 100 manufacturesthe three dimensional mold object 10 by repeatedly forming and layeringthe layers 1 using the composition (the three dimensional moldingcomposition) 11 which includes the particles 111.

As shown in FIG. 3, the three dimensional mold object manufacturingapparatus 100 has a control section 2, a composition supplying section 3which contains the composition 11 which includes the particles 111, alayer forming section 4 which forms the layers 1 using the composition11 which is supplied from the composition supplying section 3, a bindingliquid discharging section (a binding liquid applying unit) 5 whichdischarges the binding liquid 12 onto the layer 1, an energy rayirradiating unit (a curing unit) 6 which irradiates energy rays forcuring the binding liquid 12, and a bulge detecting unit 7 which detectsthe bulges 9 on the layer 1 (in the same manner as the three dimensionalmold object manufacturing apparatus 100 shown in FIGS. 5 and 7).

The control section 2 has a computer 21 and a drive control section 22.

The computer 21 is a typical desktop computer or the like which isconfigured by a CPU, a memory, or the like being internally provided.The computer 21 creates data which is model data of the shape of thethree dimensional mold object 10 and outputs cross sectional data, whichis obtained by slicing the model data into numerous thin cross sectionalbodies which are parallel to each other (slice data), with regard to thedrive control section 22. In addition, in a case where the bulge 9 isdetected using the bulge detecting unit 7 which will be described laterand the thickness of the layer 1 (the second layer) is adjusted based onthe height of the bulge 9, rewriting (correction) of the cross sectionaldata (the slice data) is performed based on the thickness of the layer 1(the second layer).

The drive control section 22 functions as a control means which drivesthe layer forming section 4, the binding liquid discharging section 5,the energy ray irradiating unit 6, the bulge detecting unit 7, and thelike. In detail, for example, the discharge pattern and the dischargeamount of the binding liquid 12 from the binding liquid dischargingsection 5, the supply amount of the composition 11 from the compositionsupplying section 3, the lowering amount of the raising and loweringstate 41, and the like are controlled.

The composition supplying section 3 is configured so as to move due tocommands from the drive control section 22 and supply the composition 11which is contained inside of the composition supplying section 3 to acomposition temporary retaining section 44.

The layer forming section 4 has the composition temporary retainingsection 44 which temporarily holds the composition 11 which is suppliedfrom the composition supplying section 3, a squeegee (a planarizingunit) 42 which planarizes the composition 11 which is held by thecomposition temporary retaining section 44 and forms the layer 1, aguide rail 43 which regulates the actions of the squeegee 42, a raisingand lowering stage (the stage) 41 which supports the layer 1 which isformed, and a frame body 45 which is provided so as to surround theraising and lowering stage 41 and to tightly fit with the raising andlowering stage 41.

The raising and lowering stage 41 is sequentially lowered by apredetermined amount due to commands from the drive control section 22when forming the layer 1 which is new on the layer 1 which is alreadyformed. The thickness of the layer 1 which is newly formed isestablished due to the lowering amount of the raising and lowering stage41. For example, in a case where the bulge 9 with a height which isequal to or higher than the predetermined height is detected on thelayer 1 (the first layer) which is formed at this time by the bulgedetecting unit 7, it is possible to adjust the thickness of the layer 1(the second layer) which is provided directly on the layer 1 (the firstlayer) where the bulge 9 is detected by adjusting the lowering amount ofthe raising and lowering stage 41 based on the height of the bulge 9.Due to this configuration, it is possible to more easily and suitablyadjust the thickness of the layer 1 (the second layer) which is provideddirectly on the layer 1 (the first layer) where the bulge 9 with aheight which is equal to or more than the predetermined height isdetected.

The stage 41 planarizes the surface (the portion where the composition11 is applied). Due to this, it is possible to easily and reliably formthe layer 1 with high uniformity of thickness.

It is preferable that the stage 41 be configured of a material with highstrength. As the configuring material of the stage 41, there are theexamples of, for example, various types of metallic materials such asstainless steel.

In addition, surface processing may be carried out on the surface of thestage 41 (the portion where the composition 11 is applied). Due to this,it is possible to, for example, effectively prevent the configuringmaterials of the composition 11 and the configuring materials of thebinding liquid 12 from becoming attached to the stage, have particularlysuperior durability of the stage 41, and achieve stable productivity ofthe three dimensional mold object 10 over a longer period of time. Asthe material which is used in the surface processing on the surface ofthe stage 41, there are the examples of, for example, a fluorine resinsuch as polytetrafluoroethylene.

The squeegee 42 has a longitudinal shape which extends in the Xdirection and is provided with a blade which has a shape with an edgewhere a front tip of a lower portion is sharp.

Since the layer 1 which is formed by the composition 11 being planarizedusing the squeegee 42 is appropriately adjusted as required based oninformation such as the presence or absence and the height of the bulge9 using the bulge detecting unit 7, disturbance of the layer 1 or thelike due to the bulge 9 and the squeegee 42 coming into contact or thelike is effectively prevented.

A vibration mechanism (which is not shown in the diagram) which appliesslight vibrations to the blade may be provided so that the length of theblade in the Y direction smoothly performs spreading of the composition11 using the squeegee 42.

The binding liquid discharging section (the binding liquid applyingunit) 5 discharges the binding liquid 12 onto the layer 1 using an inkjet system. Due to the binding liquid discharging section (the bindingliquid applying unit) 5 being provided, it is possible to apply thebinding liquid 12 with a fine pattern and it is possible to particularlyproductively manufacture even the three dimensional mold object 10 whichhas a fine structure.

As the liquid droplet discharging method (the method of the ink jetsystem), it is possible to use a piezoelectric method, a method wherethe binding liquid 12 is discharged using foam (bubbles) which aregenerated by heating the binding liquid 12, and the like, but thepiezoelectric method is preferable from the point of view ofdifficulties with changing the properties of the configuring componentsof the binding liquid 12.

The binding liquid discharging section (the binding liquid applyingunit) 5 controls the amount of the binding liquid 12 which is applied toeach section of the layer 1 as the pattern which is to be formed on eachof the layers 1 due to commands from the drive control section 22. Thedischarge pattern, the discharge amount, and the like of the bindingliquid 12 from the binding liquid discharging section (the bindingliquid applying unit) 5 is determined based on the slice data.Accordingly, for example, in a case where the thickness of the layer 1which is to be applied to the binding liquid 12 is adjusted to bethicker than the standard thickness T₀, the applying amount of thebinding liquid 12 with regard to the layer 1 is adjusted based on thethickness of the layer 1 (in proportion to the standard thickness T₀).Due to this, it is possible to apply the binding liquid 12 in an amountwhich is necessarily sufficient, it is possible to reliably form thebonded section 13 in the desired pattern, and it is possible for thethree dimensional mold object 10 to have more reliably superiordimensional precision and mechanical strength. In addition, it ispossible to reliably obtain the desired color tone in a case where acoloring agent is included in the binding liquid 12 and it is possibleto reliably prevent unintentional changes in color tone andunintentional breakdown of the color balance in accompaniment withchanges in the thickness of the layer 1.

The energy ray irradiating unit (the curing unit) 6 irradiates energyrays for curing the binding liquid 12 which is applied to the layer 1.

The type of energy ray which is irradiated from the energy rayirradiating unit 6 differs according to the configuring material of thebinding liquid 12, and there are the examples of, for example,ultraviolet rays, visible light rays, infrared rays, X rays, y rays,electron rays, ion beams, and the like. Among these, it is preferablethat ultraviolet rays are used from the point of view of cost andproductivity of the three dimensional mold object.

The bulge detecting unit 7 detects the bulges 9 on the layer 1 (thefirst layer).

Information on the presence or absence of the bulge 9 with a heightwhich is equal to or higher than the predetermined height, informationon the largest height of the bulges 9 in a case where there are thebulges 9 with a height which is equal to or higher than thepredetermined height, and the like is sent from the bulge detecting unit7 to the control section 2 and is used in adjusting the thickness of thelayer 1 (the second layer).

In the configuration shown in FIG. 3 and FIG. 4, the bulge detectingsection 7 (7A) has a light emitting section 71A which irradiates light,a light receiving section 72A which receives light from the lightemitting section 71A which is reflected, a guide rail 73A whichregulates the actions of the light emitting section 71A, and a guiderail 74A which regulates the actions of the light receiving section 72A.Then, due to the light emitting section 71A and the light receivingsection 72A being coupled and being moved in the X direction by adriving section, the whole region on the raising and lowering stage 41,where the layer 1 is provided when viewed in a planar view, is scannedand there is checking for the presence and absence of the bulges 9 witha height which is equal to or more than the predetermined height overthe entire surface of the layer 1. Due to this configuration, forexample, it is possible to appropriately adopt a line sensor which hashigher resolution as the light receiving section 72A and it is possibleto determine the height of the bulge 9 more accurately in a case wherethere are the bulges 9 on the layer 1.

In addition, in the configuration shown in FIG. 5 and FIG. 6, the bulgedetecting section 7 (7B) has a light emitting section 71B whichirradiates light and a light receiving section 72B which receives lightfrom the light emitting section 71B which is reflected, and the lightemitting section 71B and the light receiving section 72B have alongitudinal shape which is provided to extend over a range whichincludes the entirety of the layer 1 in the width direction (the Xdirection). Then, the light emitting section 71B and the light receivingsection 72B are provided to be fixed to the frame body 45 of the layerforming section 4 so as to not relatively move with regard to the layer1. Due to this configuration, since it is possible to check for thepresence and absence of the bulges 9 with a height which is equal to ormore than the predetermined height over the entire surface of the layer1 without moving the bulge detecting unit 7 (the light emitting section71B and the light receiving section 72B), it is possible to shorten thetime which is necessary for the scanning process and it is possible forthe three dimensional mold object 10 to have particularly superiorproductivity. In addition, since there are a fewer number of axes in thethree dimensional mold object 10, it is possible to simplify theapparatus configuration and achieve lower costs.

In addition, in the configuration shown in FIG. 7, the bulge detectingsection 7 (7C) determines the height of the bulge 9 by determining thefocal point distance from above the main surface of the layer 1. Due tothis configuration, since it is possible to check the presence orabsence of the bulge 9 with a height which is equal to or higher thanthe predetermined height across the entire surface of the layer 1without moving the bulge detecting unit 7, it is possible to shorten thetime which is necessary for the scanning process and it is possible forthe three dimensional mold object 10 to have particularly superiorproductivity. In addition, it is possible to determine not only theheight of the bulge 9 but accurate coordinates of the bulge 9 in the XYplane.

In the description above, the three dimensional mold objectmanufacturing apparatus has the binding liquid discharging section (thebinding liquid applying unit) and the energy ray irradiating unit (thecuring section), and the cured section (the bonded section) is formedusing these, but the three dimensional mold object manufacturingapparatus of the present embodiment is not limited to being providedwith this configuration as the means for forming the bonded section andmay be provided with, for example, an energy ray irradiating unit whichirradiates energy rays in order to fuse (sinter and join) the particlesinstead of the binding liquid discharging section (the binding liquidapplying unit) and the energy ray irradiating unit (the curing section).In an apparatus which has a configuration where the particles are fused(sintered and joined) using energy rays in the prior art, it isparticularly easy for unintentional bulges to be formed and it isdifficult to obtain the three dimensional mold object with superiordimensional precision where defects are effectively prevented from beinggenerated. In addition, in an apparatus which has a configuration wherethe particles are fused (sintered and joined) using energy rays in theprior art, removing the bulge is considered, but productivity of thethree dimensional mold object is remarkable reduced in this case. Inaddition, the bulge which are generated in this apparatus are oftenfused (sintered) due to irradiating of energy rays and it is easy fordefects to be generated in the bonded section which accompanies removingthe bulges since a relatively large force is necessary for removing thebulges. In contrast to this, it is possible to effectively prevent theproblems described above from being generated in the present embodimenteven in a case where forming of the bonded section is performed byfusing (sintering and joining) the particles due to irradiating ofenergy rays. That is, the effects of the present embodiment are moreremarkable exhibited in a case where forming of the bonded section isperformed by fusing (sintering and joining) the particles due toirradiating of energy rays.

In a case where the three dimensional mold object manufacturingapparatus is provided with the energy ray irradiating unit whichirradiates energy rays in order to fuse (sinter and join) the particles,the energy ray irradiating unit controls the energy amount of the energyrays, which are irradiated as a pattern to be formed on each of thelayers 1 (an energy ray irradiating pattern) onto each section of thelayer 1, using commands from the drive control section 22. The energyamount, the irradiating pattern, and the like of the energy rays fromthe energy ray irradiating unit are determined based on the slice data.Accordingly, the amount of irradiating energy (the output of the energyrays) which is the energy amount with regard to the layer 1 is adjustedbased on the thickness of the layer 1 (in proportion to the standardthickness T₀) in a case where, for example, the thickness of the layer 1onto which energy rays are to be irradiated is adjusted to a thicknesswhich is larger than the standard thickness T₀. Due to this, it ispossible to irradiate the energy rays with an energy amount which isnecessarily sufficient, it is possible to more reliably form the bondedsection 13 in the desired pattern, and it is possible for the threedimensional mold object 10 to have more reliably superior dimensionalprecision and mechanical strength. It is possible to perform adjustingof the output of the energy rays by, for example, adjusting the strength(power), the irradiating time, and the like of the energy rays which areirradiated.

According to the three dimensional mold object manufacturing apparatusof the present embodiment as described above, it is possible toeffectively manufacture the three dimensional mold object with superiordimensional precision where defects are effectively prevented from beinggenerated. In particular, it is possible for the three dimensional moldobject to have superior productivity in the present embodiment sinceremoving of the bulges and layer re-planarizing processing (planarizingprocessing for alleviating and eliminating disturbance to the layerwhich accompanies removing of the bulge) are not necessary. In addition,increasing of the time which is necessary for manufacturing the threedimensional mold object is effectively prevented in a case where thesize of the bulge is large and in a case where the number of the bulgesis large. In addition, it is possible to reliably prevent adverseeffects such as an increase in size, complicated structure, or highercosts since it is not necessary for the three dimensional mold objectmanufacturing apparatus to be provided with a bulge removing means.

Binding Liquid

Next, the binding liquid which is used in manufacturing the threedimensional mold object of the present embodiment will be described indetail.

The binding liquid 12 includes at least the bonding agent 121.

Bonding Agent

The bonding agent 121 may be any agent as long as it has the function ofbonding the particles 111 and preferably have hydrophobicity(lipophilic) in a case where the particles 111 have porous holes 1111which will be described later and the particles 111 where hydrophobicprocessing is carried out are used. Due to this, it is possible to havea high affinity between the binding liquid 12 and the particles 111 onwhich the hydrophobic processing is carried out and it is possible forthe binding liquid 12 to appropriately penetrate into the porous holes1111 of the particles 111 on which the hydrophobic processing is carriedout due to the binding liquid 12 being applied to the layer 1. As aresult, it is possible for an anchor effect to be appropriatelyexhibited using the bonding agent 121 and it is possible for the threedimensional mold object 10 which is obtained as a final product to haveparticularly superior mechanical strength. Here, it is sufficient if thebinding agent which is hydrophobic has a sufficiently low affinity withregard to water, but it is preferable that the solubility with regard towater at 25° C. is, for example, equal to or less than 1 (g/100 g ofwater).

As the bonding agent 121, there are the examples of, for example,thermoplastic resins, thermosetting resins, various types ofphotocurable resins such as visible light curable resins which are curedusing the spectrum of visible light (photocurable resins in a narrowsense), ultraviolet ray curable resins, and infrared curable resins,X-ray curable resins, and the like, and it is possible to use one typeor a combination of two or more types which are selected from these.Among these, it is preferable that the bonding agent 121 includes acurable resin from the point of view of mechanical strength of the threedimensional mold object 10 which is obtained, productivity of the threedimensional mold object 10, and the like. In addition, among the varioustypes of curable resins, ultraviolet ray curable resins (polymerizablecompounds) are particularly preferable from the point of view ofmechanical strength of the three dimensional mold object 10 which isobtained, productivity of the three dimensional mold object 10, safestorage of the bonding agent 121, and the like.

As the ultraviolet ray curable resins (polymerizable compounds), it ispreferable to use a resin where addition polymerization or ring-openingpolymerization is started and a polymer is generated due to a radialtype or a cation type which is generated from a photopolymerizationinitiator due irradiating of ultraviolet rays. As the additionpolymerization format, there are the examples of radial, cation, anion,metathesis, and coordination polymerization. In addition, as thering-opening polymerization format, there are the examples of cation,anion, radial, metathesis, and coordination polymerization.

As the addition polymerizable compound, there are the examples of, forexample, a compound which has at least one ethyleny unsaturated doublebond and the like. As the addition polymerizable compound, it ispossible to preferably use a compound with at least one or morepreferable two or more terminal ethyleny unsaturated bonds.

The polymerizable compound with the ethyleny unsaturated bond has achemical form of a monofunctional polymerizable compound, apolyfunctional polymerizable compound, or a mixture of these. As themonofunctional polymerizable compound, there are the examples of, forexample, unsaturated carboxylic acids (for example, acrylic acids,methacrylic acids, itaconic acids, crotonic acids, isocrotonic acids,maleic acids, and the like) and esters, amides, and the like of theunsaturated carboxylic acids. As the polyfunctional polymerizablecompound, an ester of an unsaturated carboxylic acid and an aliphaticpolyalcohol compound, an amide of an unsaturated carboxylic acid and analiphatic polyamine compound, and the like are used.

In addition, it is possible to also use an addition reactant with anester, amide, isocyanate, or epoxy of unsaturated carboxylic acid whichhas a nucleophilic substituent such as a hydroxyl group, an amino group,or a mercapto group or a dehydration condensation reactant with thecarboxylic acid. In addition, it is possible to also use an additionreactant with an ester, amide, alcohol, amine, or thiol of unsaturatedcarboxylic acid which has an electrophilic substituent such as anisocyanate group or an epoxy group and a substitution reactant with anester, amide, alcohol, amine, or thiol of unsaturated carboxylic acidwhich has a detaching substituent group such as a halogen group or atosyloxy group.

As specific examples of a radical polymerizable compound which is anester of an unsaturated carboxylic acid and an aliphatic polyalcoholcompound, for example, (meth) acrylate ester is representative and it ispossible to use monofunctional and polyfunctional (meth) acrylateesters.

As specific examples of monofunctional (meth) acrylate, there are theexamples of, for example, tolyloxy methyl ethyl (meth) acrylate,phenyloxy ethyl (meth) acrylate, cyclohexyl (meth) acrylate, ethyl(meth) acrylate, methyl (meth) acrylate, isobornyl (meth) acrylate,tetrahydro furfuryl (meth) acrylate, and the like.

As specific examples of bifunctional (meth) acrylate, there are theexamples of, for example, ethylene glycol di(meth) acrylate, triethyleneglycol di(meth) acrylate, 1,3-butanediol di(meth) acrylate,tetramethylene glycol di(meth) acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth) acrylate, hexanediol di(meth)acrylate, 1,4-cyclohexane diol di(meth) acrylate, tetraethylene glycoldi(meth) acrylate, pentaerythritol di(meth) acrylate, dipentaerythritoldi(meth) acrylate, and the like.

As specific examples of trifunctional (meth) acrylate, there are theexamples of, for example, trimethylolpropane tri(meth) acrylate,trimethylolpropane tri(meth) acrylate, trimethylolpropane alkyleneoxide-modified tri(meth) acrylate, pentaerythritol tri(meth) acrylate,dipentaerythritol tri(meth) acrylate, trimethylolpropane tri((meth)acryloyloxy propyl) ether, isocyanurate alkylene oxide-modifiedtri(meth) acrylate, propionate dipentaerythritol tri(meth) acrylate,tri((meth) acryloyloxyethyl) isocyanurate, hydroxypivalaldehyde-modifieddimethylol propane tri(meth) acrylate, sorbitol tri(meth) acrylate, andthe like.

As specific examples of tetrafunctional (meth) acrylate, there are theexamples of, for example, pentaerythritol tetra(meth) acrylate, sorbitoltetra(meth) acrylate, ditrimethylolpropane tetra(meth) acrylate,propionate dipentaerythritol tetra(meth) acrylate, ethoxylatedpentaerythritol tetra(meth) acrylate, and the like.

As specific examples of pentafunctional (meth) acrylate, there are theexamples of, for example, sorbitol penta(meth) acrylate,dipentaerythritol penta(meth) acrylate, and the like.

As specific examples of hexafunctional (meth) acrylate, there are theexamples of, for example, dipentaerythritol hexa(meth) acrylate,sorbitol hexa(meth) acrylate, phosphazene alkylene oxide-modifiedhexa(meth) acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, and the like.

As polymerizable compounds other than (meth) acrylate, there are theexamples of, for example, itaconic acid esters, crotonic acid esters,isocrotonic acid esters, maleic acid esters, and the like.

As the itaconic acid esters, there are the examples of, for example,ethylene glycol diitaconate, propylene glycol diitaconate,1,3-butanediol diitaconate, 1,4-butanediol diitaconate, tetramethyleneglycol diitaconate, pentaerythritol diitaconate, sorbitoltetraitaconate, and the like.

As the crotonic acid esters, there are the examples of, for example,ethylene glycol dicrotonate, tetramethylene glycol dicrotonate,pentaerythritol dicrotonate, sorbitol tetra dicrotonate, and the like.

As the isocrotonic acid esters, there are the examples of, for example,ethylene glycol isocrotonate, pentaerythritol isocrotonate, sorbitoltetraisocrotonate, and the like.

As the maleic acid esters, there are the examples of, for example,ethylene glycol dimaleate, triethylene glycol dimaleate, pentaerythritoldimaleate, sorbitol tetra malate, and the like.

As examples of other esters, it is possible to use aliphatic alcoholesters described in Japanese Examined Patent Application Publication No.S46-27926, Japanese Examined Patent Application Publication No.S51-47334, and Japanese Unexamined Patent Application Publication No.S57-196231, esters with an aromatic skeleton described in JapaneseUnexamined Patent Application Publication No. S59-5240, JapaneseUnexamined Patent Application Publication No. S59-5241, and JapaneseUnexamined Patent Application Publication No. H2-226149, esters with anamino group described in Japanese Unexamined Patent ApplicationPublication No. H1-165613, and the like.

As specific examples of a monomer of an amide of an unsaturatedcarboxylic acid and an aliphatic polyalcohol compound, there are theexamples of, for example, methylenebis-acrylamide,methylenebis-methacrylamide, 1,6-hexamethylene bis-acrylamide,1,6-hexamethylene bis-methacrylamide, diethylenetriamine trisacrylamide, xylylene bisacrylamide, xylylene bismethacrylamide, and thelike.

As other preferable amide monomers, there are the examples of, forexample, amide monomers with a cyclohexylene structure described inJapanese Examined Patent Application Publication No. S54-21726 and thelike.

In addition, a urethane additional polymerization compound which ismanufactured using an additional reaction between isocyanate and ahydroxyl group is also appropriate, and as specific examples of this,there are the examples of, for example, vinyl uretange compounds whichincludes two or more polymerizable vinyl groups in one molecule where avinyl monomer, which contains a hydroxyl group shown as formula (1)below, is added to a polyisocyanate compound which has two or moreisocyanate groups in one molecule which is described in JapaneseExamined Patent Application Publication No. S48-41708 and the like.CH₂═C(R¹)COOCH₂CH(R²)OH  (1)

(Here, R¹ and R² in formula (1) each individually represent H or CH3.)

In the present embodiment, it is possible to appropriately use a cationring-opening polymerizable compound, which has one or more cyclic ethergroups such as an epoxy group or a oxetane group in a molecule, as theultraviolet ray curable resin (the polymerizable compound).

As the cation polymerization compound, there are the examples of, forexample, curable compounds which include a ring-opening polymerizablegroup and the like, and among these, a curable compound which includes ahetero ring group is particularly preferable. As this curable compound,there are the examples of, for example, epoxy derivatives, oxetanederivatives, tetrahydrofuran derivatives, cyclic lactone derivatives,cyclic carbonate derivatives, cyclic imino ethers such as oxazolinederivatives, vinyl ethers, and the like, and among these, epoxyderivatives, oxetane derivatives, and vinyl ethers are preferable.

As examples of preferable epoxy derivatives, there are the examples of,for example, monofunctional glycidyl ethers, multifunctional glycidylethers, monofunctional cycloaliphatic epoxies, polyfunctionalcycloaliphatic epoxies, and the like.

Specific examples of specific glycidyl ether compounds includes theexamples of diglycidyl ethers (for example, ethylene glycol diglycidylethers, bisphenol A diglycidyl ethers, and the like), glycidyl etherswith three or more functional groups (for example, trimethylol ethanetriglycidyl ethers, trimethylol propane triglycidyl ethers, glyceroltriglycidyl ether, triglycidyl tris-hydroxyethyl isocyanurate, and thelike), glycidyl ethers with four or more functional groups (for example,sorbitol tetra glycidyl ethers, pentaerythritol tetraglycyl ethers,polyglycidyl ethers of cresol novolac resins, polyglycidyl ethers ofphenol novolac resins, and the like), alicyclic epoxy (for example,CELLOXIDE 2021P, CELLOXIDE 2081, EPOLEAD GT-301, and EPOLEAD GT-401 (allmanufactured by Daicel Corp.), EHPE (manufactured by Daicel Corp.),polycyclohexyl epoxy methyl ether of phenol novolac resin, oxetanes (forexample, OX-SQ and PNOX-1009 (all manufactured by Toagosei Co., Ltd.),and the like.

It is possible to preferably use alicyclic epoxy derivatives as thepolymerizable compound. An “alicyclic epoxy group” refer to partialstructures where a double bond of a cycloalkane ring such as acyclopentene group or a cyclohexene group is epoxied using anappropriate oxidizing agent such as hydrogen peroxide or peracid.

As the alicyclic epoxy derivative, polyfunctional cycloaliphaticepoxies, which have two or more of a cyclohexene oxide group or acyclopentene oxide group in one molecule, are preferable. As specificexamples of alicyclic epoxy compounds, there are the examples of, forexample, 4-vinyl cyclohexene dioxide, (3,4-epoxy cyclohexyl) methyl3,4-epoxy cyclohexyl carboxylate, di(3,4-epoxy cyclohexyl) adipate,di(3,4-epoxy cyclohexyl methyl) adipate, bis (2,3-epoxycyclopentyl)ether, di(2,3-epoxy-6-methylcyclo hexylmethyl) adipate,dicyclopentadiene dioxide, and the like.

It is possible to use a glycidyl compound, which has a typical epoxygroup which does not have an alicyclic structure in the molecular,individually or together with the alicyclic epoxy derivative describedabove.

As a typical glycidyl compound, it is possible for there to be theexamples of, for example, a glycidyl ether compound, a glycidyl estercompound, and the like, but use together with a glycidyl ether compoundis preferable.

As specific examples of the glycidyl ether compound, there are theexamples of, for example, aromatic glycidyl ether compounds such as1,3-bis (2,3-epoxypropyloxy) benzene, a bisphenol A type epoxy resin, abisphenol F-type epoxy resin, a phenol novolac epoxy resin, a cresolnovolac epoxy resin, and a trisphenolmethane epoxy resin, aliphaticglycidyl ether compounds such as 1,4-butanediol glycidyl ether, glyceroltriglycidyl ether, propylene glycol diglycidyl ether, andtrimethylolpropane triglycidyl ether, and the like. As the glycidylether, it is possible for there to be the examples of, for example, alinoleate dimer glycidyl ether and the like.

As the polymerizable compound, it is possible to use a compound whichhas an oxetanyl group which is a cyclic ether with a four-membered ring(referred to below simply as “oxetanyl group”). The compound whichincludes an oxetanyl group is a compound with one or more oxetanylgroups in one molecule.

The content ratio of the bonding agent in the binding liquid 12 ispreferable 80% or more by mass and is more preferably 85% or more bymass. Due to this, it is possible for the three dimensional mold object10 which is obtained as a final product to have particularly superiormechanical strength.

Other Compounds

In addition, the binding liquid 12 may include compounds other than thecompounds described above. As the other compounds, there are theexamples of, for example, various types of coloring agents such aspigments and dyes, a dispersing agent, a surfactant, a polymerizationinitiator, a polymerization accelerator, a solvent, a penetrationenhancing agent, a wetting agent (a moisturizing agent), a fixing agent,an antimold agent, a preserving agent, an antioxidizing agent, anultraviolet absorbing agent, a chelating agent, a pH adjusting agent, athickening agent, a filler, an aggregation inhibitor, a defoamer, andthe like.

In particular, due to the binding liquid 12 including a coloring agent,it is possible to obtain the three dimensional mold object 10 which iscolored with a color which corresponds to the color of the coloringagent.

In particular, due to a pigment being included as the color agent, it ispossible for light proofing of the binding liquid 12 and the threedimensional mold object 10 to be favorable. It is possible for anyinorganic pigment or organic pigment to be used as the pigment.

As the inorganic pigment, there are the examples of, for example, typesof carbon black (C.I. Pigment Black 7) such as furnace black, lampblack, acetylene black, and channel black, iron oxide, titanium oxide,and the like, and it is possible to use one type or a combination of twoor more types which are selected from these.

Among the inorganic pigments, titanium oxide is preferable for apreferable white color.

As the organic pigment, there are the examples of, for example, azopigments such as an insoluble azo pigment, a condensed azo pigment, anazo lake pigment, and a chelate azo pigment, polycyclic pigments such asa phthalocyanine pigment, a perylene pigment, a perynone pigment, ananthraquinone pigment, a quinacridone pigment, a dioxane pigment, athioindigo pigments, and a quinophthalone pigment, dye chelates (forexample, basic dye chelates, acidic dye chelates, and the like), colorlakes (basic dye lakes and acidic dye lakes), nitro pigments, nitrosopigments, aniline black, daylight fluorescent pigments, and the like,and it is possible to use one type or a combination of two or more typeswhich are selected from these.

In further detail, as carbon black which is used as a black pigment,there are the examples of, for example, No. 2300, No. 900, MCF88, No.33, No. 40, No. 45, No. 52, MA7, MA8, MA100, No. 2200B, and the like(all manufactured by Mitsubishi Chemical Corp.), Raven 5750, Raven 5250,Raven 5000, Raven 3500, Raven 1255, Raven 700, and the like (allmanufactured by Carbon Columbia Inc.), Regal 400R, Regal 330R, Regal660R, Mogul L, Monarch 700, Monarch 800, Monarch 880, Monarch 900,Monarch 1000, Monarch 1100, Monarch 1300, Monarch 1400, and the like(all manufactured by CABOT JAPAN K.K.), Color Black FW1, Color BlackFW2, Color Black FW2V, Color Black FW18, Color Black FW200, Color BlackS150, Color Black S160, Color Black S170, Printex 35, Printex U, PrintexV, Printex 140U, Special Black 6, Special Black 5, Special Black 4A,Special Black 4, and the like (all manufactured by Degussa AG), and thelike.

As white pigments, there are the examples of, for example, C.I. pigmentwhite 6, 18, 21, and the like.

As yellow pigments, there are the examples of, for example, C.I. pigmentyellow 1, 2, 3, 4, 5, 6, 7, 10, 11, 12, 13, 14, 16, 17, 24, 34, 35, 37,53, 55, 65, 73, 74, 75, 81, 83, 93, 94, 95, 97, 98, 99, 108, 109, 110,113, 114, 117, 120, 124, 128, 129, 133, 138, 139, 147, 151, 153, 154,167, 172, 180, and the like.

As magenta pigments, there are the examples of, for example, C.I.pigment red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18,19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48 (Ca), 48 (Mn), 57(Ca), 57:1, 88, 112, 114, 122, 123, 144, 146, 149, 150, 166, 168, 170,171, 175, 176, 177, 178, 179, 184, 185, 187, 202, 209, 219, 224, 245,and C.I. pigment violet 19, 23, 32, 33, 36, 38, 43, 50, and the like.

As cyan pigments, there are the examples of, for example, C.I. pigmentblue 1, 2, 3, 15, 15:1, 15:2, 15:3, 15:34, 15:4, 16, 18, 22, 25, 60, 65,66, and C.I. vat blue 4, 60, and the like.

In addition, as pigments other than the pigments described above, thereare the examples of, for example, C.I. pigment green 7, 10, C.I. pigmentbrown 3, 5, 25, 26, C.I. pigment orange 1, 2, 5, 7, 13, 14, 15, 16, 24,34, 36, 38, 40, 43, 63, and the like.

In a case where the binding liquid 12 includes a pigment, the averageparticular diameter of the pigment is preferably 300 nm or less and ismore preferably 50 nm or more and 250 nm or less. Due to this, it ispossible to have particularly superior discharge stability of thebinding liquid 12 and pigment dispersing stability within the bindingliquid 12, and it is possible to form images with more superior imagequality.

In addition, as dyes, there are the examples of, for example, acid dyes,direct dyes, reactive dyes, basic dyes, and the like, and it is possibleto use one type or a combination of two or more types which are selectedfrom these.

As specific examples of dyes, there are the examples of, for example,C.I. acid yellow 17, 23, 42, 44, 79, 142, C.I. acid red 52, 80, 82, 249,254, 289, C.I. acid blue 9, 45, 249, C.I. acid black 1, 2, 24, 94, C.I.food black 1, 2, C.I. direct yellow 1, 12, 24, 33, 50, 55, 58, 86, 132,142, 144, 173, C.I. direct red 1, 4, 9, 80, 81, 225, 227, C.I. directblue 1, 2, 15, 71, 86, 87, 98, 165, 199, 202, C.I. direct black 19, 38,51, 71, 154, 168, 171, 195, C.I. reactive red 14, 32, 55, 79, 249, C.I.reactive black 3, 4, 35, and the like.

In a case where the binding liquid 12 includes a coloring agent, thecontent ratio of the coloring agent in the binding liquid 12 ispreferably 1% or more by mass and 20% or less by mass. Due to this,particularly superior concealment and color reproduction are obtained.

In particular, in a case where the binding liquid 12 includes titaniumoxide as the coloring agent, the content ratio of titanium oxide in thebinding liquid 12 is preferably 12% or more by mass and 18% or less bymass and is more preferably 14% or more by mass and 16% or less by mass.Due to this, particularly superior concealment is obtained.

In a case where the binding liquid 12 includes a pigment, more favorabledispersing of the pigment is possible if a dispersing agent is alsoincluded. The dispersing agent is not particularly limited and there arethe examples of, for example, dispersing agents which are commonly usedin preparing pigment dispersion liquids such as polymer dispersingagents. As specific examples of polymer dispersing agents, there are theexamples of, for example, dispersing agents with a main component whichis one or more type from polyoxyalkylene polyalkylene polyamines, vinylpolymer and copolymers, acrylic polymers and copolymers, polyesters,polyamides, polyimides, polyurethanes, amino polymers,silicon-containing polymers, sulfur-containing polymers,fluorine-containing polymers, and epoxy resins. As a commerciallyavailable product of a polymer dispersing agent, there are the examplesof, for example, the AJISPER series from Ajinomoto Fine-Techno Co.,Inc., the SOLSPERSE series (SOLSPERSE 36000 and the like) from LubrizolCorp., the DISPERBYK series from BYK-Chemie GmbH, the DISPARLON seriesfrom Kusumoto Chemicals, Ltd., and the like.

It is possible for the three dimensional mold object 10 to have morefavorable abrasion resistance if the binding liquid 12 includes asurfactant. The surfactant is not particularly limited and it ispossible to use, for example, polyester-modified silicone,polyether-modified silicone, and the like as silicone-based surfactants,and among these, polyether-modified polydimethyl siloxane and polyestermodified polydimethyl siloxane are preferable. As specific examples ofthe surfactant, there are the examples of, for example, BYK-347,BYK-348, BYK-UV3500, 3510, 3530, 3570 (all product names manufactured byBYK-Chemie GmbH), and the like.

In addition, the binding liquid 12 may include a solvent. Due to this,it is possible for adjusting of the viscosity of the binding liquid 12to be appropriately performed and it is possible for discharge stabilityof the binding liquid 12 using an ink jet system to be particularlysuperior even when the binding liquid 12 includes components with highviscosity.

As the solvent, there are the examples of, for example, (poly)alkyleneglycol monoalkyl ethers such as ethylene glycol monomethyl ether,ethylene glycol monoethyl ether, propylene glycol monomethyl ether, andpropylene glycol mono ethyl ether, acetic acid esters such as ethylacetate, n-propyl acetate, iso-propyl acetate, n-butyl acetate, andiso-butyl acetate, aromatic hydrocarbons such as benzene, toluene, andxylene, ketones such as methyl ethyl ketone, acetone, methyl isobutylketone, ethyl-n-butyl ketone, diisopropyl ketone, and acetylacetone,alcohols such as ethanol, propanol, and butanol, and it is possible touse one type or a combination of two or more types which are selectedfrom these.

In addition, the viscosity of the binding liquid 12 is preferably 10mPa·s or more and 30 mPa·s or less and is more preferably 15 mPa·s ormore and 25 mPa·s or less. Due to this, it is possible for the bindingliquid 12 to have particularly superior discharge stability using an inkjet system. Here, viscosity in the present specifications is a valuewhich is measured at 25° C. using an E type viscometer (VISCONIC ELDmanufactured by Tokyo Keiki Inc.).

In addition, a plurality of types of the binding liquid 12 may be usedin manufacturing the three dimensional mold object 10.

For example, the binding liquid 12 which includes a coloring agent (acolor ink) and the binding liquid 12 which does not include a coloringagent (a clear ink) may be used. Due to this, for example, the bindingliquid 12 which includes a coloring agent may be used as the bindingliquid 12 which is applied to a region which affects the color tone interms of the outer appearance of the three dimensional mold object 10and the binding liquid 12 which does not include a coloring agent may beused as the binding liquid 12 which is applied to a region which doesnot affect the color tone in terms of the outer appearance of the threedimensional mold object 10. In addition, a plurality of types of thebinding liquid 12 may be used together such that a region (a coatinglayer), which is formed using the binding liquid 12 which does notinclude a coloring agent, is provided on the outer surface of a region,which is formed using the binding liquid 12 which includes a coloringagent, in the three dimensional mold object 10 which is obtained as afinal product.

In addition, for example, a plurality of types of the binding liquid 12,which include coloring agents with different compositions, may be used.Due to this, it is possible to have a wide color reproduction regionwhich is able to be expressed using combinations of the binding liquids12.

In a case where a plurality of types of the binding liquids 12 are used,it is preferable that at least the binding liquid 12 with a cyan color,the binding liquid 12 with a magenta color, and the binding liquid 12with a yellow color be used. Due to this, it is possible to have a widercolor reproduction region which is able to be expressed usingcombinations of the binding liquids 12.

In addition, the following effects are obtained when, for example, thebinding liquid 12 with a white color is used together with the bindingliquids 12 with other colors. That is, it is possible for the threedimensional mold object 10 which is obtained as a final product to havea first region where the binding liquid 12 with a white color is appliedand a region (a second region) where the binding liquids 12 with thecolors other than white are applied to overlap with the first region andbe provided more to the outer surface side than the first region. Due tothis, it is possible for the first region where the binding liquid 12with a white color is applied to exhibit concealment and it is possiblefor further increase color intensity of the three dimensional moldobject 10.

Composition (Three Dimensional Molding Composition)

Next, the composition (the three dimensional molding composition) 11which is used in manufacturing of the three dimensional mold object ofthe present embodiment will be described in detail next.

FIG. 8 is a cross sectional diagram schematically illustrating a statein the layer (the three dimensional mold object) immediately before acomposition applying process. FIG. 9 is a cross sectional diagramschematically illustrating a state where the particles are bondedtogether using the binding agent which is hydrophobic.

The composition (the three dimensional molding composition) 11 includesat least a three dimensional molding powder which includes a pluralityof the particles 111.

Three Dimensional Molding Powder (Particles 111)

It is preferable that the particles 111 which configure the threedimensional molding powder be porous and be subject to a hydrophobicprocessing. Due to this configuration, in a case where the bindingliquid 12 includes the bonding agent 121 which is hydrophobic, it ispossible for the bonding agent 121 which is hydrophobic to appropriatelypenetrate inside the porous holes 1111 and for an anchor effect to beexhibited when manufacturing the three dimensional mold object 10, andas a result, it is possible to have a superior bonding force in thebonding together of the particles 111 (a bonding force using the bondingagent 121) and it is possible to appropriately manufacture the threedimensional mold object 10 with superior mechanical strength as a result(refer to FIG. 9). In addition, it is possible for the three dimensionalmolding powder to be appropriately reused. To describe in more detail,since a water soluble resin 112 which will be described later isprevented from entering into the porous holes 1111 if the hydrophobicprocessing is carried out on the particles 111 which configure the threedimensional mold object, it is possible for the particles 111 in aregion where the binding liquid 12 is not applied to be recovered with ahigh level of purity where the content of impurities is low due to beingwashed using water or the like in manufacturing of the three dimensionalmold object 10. For this reason, it is possible to obtain the threedimensional molding composition where the desired composition isreliably controlled by again mixing the three dimensional molding powderwhich is recovered and the water soluble resin 112 in desiredproportions. In addition, it is possible to effectively preventunintentional wet spreading of the binding liquid 12 due to the bondingagent 121 which configures the binding liquid 12 entered into the porousholes 1111 of the particles 111. As a result, it is possible for thedimensional precision of the three dimensional mold object 10 which isobtained as a final result to be even higher.

As the configuring material of the particles 111 which configure thethree dimensional molding powder (particles on which the hydrophobicprocessing is carried out), there are the examples of, for example,inorganic material, organic materials, or a composite of these.

As the inorganic materials which configure the particles 111, there arethe examples of, for example, various types of metals, metal compounds,and the like. As the metal compounds, there are the examples of, forexample, various types of metal oxides such as silica, alumina, titaniumoxide, zinc oxide, zirconium oxide, tin oxide, magnesium oxide, andpotassium titanate, various types of metal hydroxides such as magnesiumhydroxide, aluminum hydroxide, and calcium hydroxide, various types ofmetal nitride such as silicon nitride, titanium nitride, and aluminumnitride, various types of metal carbides such as silicon carbide andtitanium carbide, various types of metal sulfides such as zinc sulfide,various types of metal carbonates such as calcium carbonate andmagnesium carbonate, various types of metal sulfates such as calciumsulfate and magnesium sulfate, various types of metal silicates such ascalcium silicate and magnesium silicate, various types of metalphosphates such as calcium phosphate, various types of metal boratessuch as aluminum borate and magnesium borate, a composite of these, orthe like.

As the organic materials which configure the particles 111, there arethe examples of, for example, synthetic resins, natural polymers, andthe like, and in more detail, there are the examples of polyethyleneresin, polypropylene, polyethylene oxide, polypropylene oxide,polyethylene imine, polystyrene, polyurethane, polyuria, polyester,silicone resin, acrylic silicone resin, polymers with a (meth) acrylateester such as polymethyl methacrylate as a configuring monomer,crosspolymers with a (meth) acrylate ester such as a methyl methacrylatecross polymer as a configuring monomer (ethylene acrylate copolymerresin), polyamide resins such as nylon 12, nylon 6, or nylon copolymers,polyimide, carboxymethyl cellulose, gelatin, starch, chitin, chitosan,and the like.

Among these, the particles 111 are preferably configured using inorganicmaterials, are more preferably configured using a metal oxide, and areeven more preferably configured using silica. Due to this, it ispossible for the three dimensional mold object 10 to have particularlysuperior characteristics such as mechanical strength and durability. Inaddition, in particular, the effects described above are more remarkablyexhibited if the particles 111 are configured using silica. In addition,since silica has superior fluidity, it is effective in forming thelayers 1 with even higher uniformity in thickness and it is effectivehaving particularly superior productivity and dimensional precision ofthe three dimension mold object 10.

It is sufficient if the hydrophobic processing, which is carried out onthe particles 111 which configure the three dimensional molding powder,is any process which increases the hydrophobicity of the particles 111,but a process which introduces a hydrocarbon group is preferable. Due tothis, it is possible for the hydrophobicity of the particles 111 to behigher. In addition, it is possible for the uniformity of the extent ofthe hydrophobic processing to be higher for each of the particles 111and each portion on the surface of the particles 111 (including thesurfaces inside of the porous holes 1111) in an easy and reliablemanner.

A silane compound which includes a silyl group is preferable as thecompound which is used in the hydrophobic processing. As specificexamples of the compound which is able to be used in the hydrophobicprocessing, there are the examples of, for example, hexamethyldisilazane, dimethyl dimethoxy silane, diethyl diethoxy silane,1-propenyl methyl dichloro silane, propyl dimethyl chloro silane, propylmethyl dichloro silane, propyl trichloro silane, propyl triethoxysilane, propyl trimethoxy silane, styrylethyl trimethoxy silane,tetradecyl trichloro silane, 3-thiocyanate propyl triethoxy silane,p-tolyl dimethyl chloro silane, p-tolyl methyl dichloro silane, p-tolyltrichloro silane, p-tolyl trimethoxy silane, p-tolyl triethoxy silane,di-n-propyl di-n-propoxy silane, diisopropyl diisopropoxy silane,di-n-butyl di-n-propoyl silane, di-sec-butyl di-sec-butyloxy silane,di-t-butyl di-t-butyloxy silane, octadecyl trichloro silane, octadecylmethyl diethoxy silane, octadecyl triethoxy silane, octadecyl trimethoxysilane, octadecyl dimethyl chloro silane, octadecyl methyl dichlorosilane, octadecyl methoxy dichloro silane, 7-octenyl dimethyl chlorosilane, 7-octenyl trichloro silane, 7-octenyl trimethoxy silane,octylmethyl dichloro silane, octyldimethyl chloro silane, octyltrichloro silane, 10-undecenyl dimethyl chloro silane, undecyl trichlorosilane, vinyldimethyl chloro silane, methyl octadecyl dimethoxy silane,methyl dodecyl diethoxy silane, methyl octadecyl silane, methyloctadecyl diethoxy silane, n-octyl methyl dimethoxy silane, n-octylmethyl diethoxy silane, triacontyl dimethyl chloro silane, triacontyltrichloro silane, methyl trimethoxy silane, methyl triethoxy silane,methyl tri-n-propoxy silane, methyl isopropoxy silane, methyl-n-butyloxysilane, methyl tri-sec-butyloxy silane, methyl tri-t-butyloxy silane,ethyl trimethoxy silane, ethyl triethoxy silane, ethyl tri-n-propoxysilane, ethyl isopropoxy silane, ethyl-n-butyloxy silane, ethyltri-sec-butyloxy silane, ethyl tri-t-butyloxy silane, n-propyltrimethoxy silane, isobutyl trimethoxy silane, n-hexyl trimethoxysilane, hexadecyl trimethoxy silane, n-octyl trimethoxy silane,n-dodecyl trimethoxy silane, n-octadecyl trimethoxy silane, n-propyltriethoxy silane, isobutyl triethoxy silane, n-hexyl triethoxy silane,hexadecyl triethoxy silane, n-octyl triethoxy silane, n-dodecyltrimethoxy silane, n-octadecyl triethoxy silane,2-[2-(trichlorosilyl)ethyl] pyridine, 4-[2-(trichlorosilyl)ethyl]pyridine, diphenyl dimethoxy silane, diphenyl diethoxy silane,1,3(trichlorosilyl methyl) heptacosane, dibenzyl dimethoxy silane,dibenzyl diethoxy silane, phenyl trimethoxy silane, phenyl methyldimethoxy silane, phenyl dimethyl methoxy silane, phenyl dimethoxysilane, phenyl diethoxy silane, phenyl methyl diethoxy silane, phenyldimethyl ethoxy silane, benzyl triethoxy silane, benzyl trimethoxysilane, benzyl methyl dimethoxy silane, benzyl dimethyl methoxy silane,benzyl dimethoxy silane, benzyl diethoxy silane, benzyl methyl diethoxysilane, benzyl dimethyl ethoxy silane, benzyl triethoxy silane, dibenzyldimethoxy silane, dibenzyl ethoxy silane, 3-acetoxy propyl trimethoxysilane, 3-acryloxypropyl trimethoxy silane, allyl trimethoxy silane,allyl triethoxy silane, 4-aminobutyl triethoxy silane, (aminoethylaminomethyl) phenethyl trimethoxy silane, N-(2-aminoethyl)-3-aminopropylmethyl dimethoxy silane, N-(2-aminoethyl)-3-aminopropyl trimethoxysilane, 6-(aminohexyl aminopropyl) trimethoxy silane, p-aminophenyltrimethoxy silane, p-aminophenyl ethoxy silane, m-aminophenyl trimethoxysilane, m-aminophenyl methoxy silane, 3-aminopropyl trimethoxy silane,3-aminopropyl triethoxy silane, ω-amino undecyl trimethoxy silane, amyltriethoxy silane, benzoxa silepin dimethyl ester, 5-(bicycle heptenyl)triethoxy silane, bis(2-hydroxyethyl)-3-aminopropyl triethoxy silane,8-bromooctyl trimethoxy silane, bromophenyl trimethoxy silane,3-bromopropyl trimethoxy silane, n-butyl trimethoxy silane,2-chloromethyl triethoxy silane, chloromethyl methyl diethoxy silane,chloromethyl methyl diisopropoxy silane, p-(chloromethyl) phenyltrimethoxy silane, chloromethyl triethoxy silane, chlorophenyl triethoxysilane, 3-chloropropyl methyl dimethoxy silane, 3-chloropropyl triethoxysilane, 3-chloropropyl trimethoxy silane, 2-(4-chlorosulfonyl phenyl)ethyl trimethoxy silane, 2-cyanoethyl triethoxy silane, 2-cyanoethyltrimethoxy silane, cyanomethyl phenethyl trimethoxy silane,3-cyanopropyl triethoxy silane, 2-(3-cyclohexenyl)ethyl trimethoxysilane, 2-(3-cyclohexenyl)ethyl triethoxy silane, 3-cyclohexenyltrichloro silane, 2-(3-cyclohexenyl)ethyl trichloro silane,2-(3-cyclohexenyl)ethyl chloro dimethyl silane, 2-(3-cyclohexenyl)ethylmethyl dichloro silane, cyclohexyl dimethyl chloro silane,cyclohexylethyl dimethoxy silane, cyclohexyl methyl dichloro silane,cyclohexyl methyl dimethoxy silane, (cyclohexyl methyl) trichlorosilane, cyclohexyl trichloro silane, cyclohexyl trimethoxy silane,cyclooctyl trichloro silane, (4-cyclooctenyl) trichloro silane,cyclopentyl trichloro silane, cyclopentyl trimethoxy silane,1,1-diethoxy-1-silacyclo pentadiene-3-ene, 3-(2,4-dinitro phenyl)propyltriethoxy silane, (dimethyl chlorosilyl) methyl-7,7-dimethyl norpinane,(cyclohexyl aminomethyl) methyl diethoxy silane, (3-cyclopentadienylpropyl) triethoxy silane, N,N-diethyl-3-aminopropyl trimethoxysilane, 2-(3,4-epoxy cyclohexyl) ethyl trimethoxy silane, 2-(3,4-epoxycyclohexyl) ethyl triethoxy silane, (furfuryloxy methyl) triethoxysilane, 2-hydroxy-4-(3-triethoxy propoxy) diphenyl ketone, 3-(p-methoxyphenyl) propyl methyl dichloro silane, 3-(p-methoxy phenyl) propyltrichloro silane, p-(methyl phenethyl) methyl dichloro silane, p-(methylphenethyl) trichloro silane, p-(methyl phenethyl) dimethyl chlorosilane, 3 morpholinopropyl trimethoxy silane, (3-glycidoxy propyl)methyl diethoxy silane, 3-glycidoxy propyl trimethoxy silane,1,2,3,4,7,7-hexachloro-6-methyl diethoxy silyl-2-norbornene,1,2,3,4,7,7-hexachloro-6-triethoxy silyl-2-norbornene, 3-iodopropyltrimethoxy silane, 3-isocyanato propyl triethoxy silane, (mercaptomethyl) methyl diethoxy silane, 3-mercapto propyl methyl dimethoxysilane, 3-mercaptopropyl dimethoxy silane, 3-mercaptopropyl triethoxysilane, 3-methacryloxypropyl methyldiethoxy silane, 3-methacryloxypropyltrimethoxy silane, methyl{2-(3-trimethoxysilyl propylamino)ethylamino}-3-propionate, 7-octenyloxy trimethoxy silane,R—N-α-phenethyl-N′-triethoxysilyl propyl urea,S—N-α-phenethyl-N′-triethoxysilyl propyl urea, phenethyl trimethoxysilane, phenethyl methyl dimethoxy silane, phenethyl dimethyl silane,phenethyl dimethoxy silane, phenethyl diethoxy silane, phenethylmethyldiethoxy silane, phenethyl dimethylethoxy silane, phenethyltrimethoxy silane, (3-phenylpropyl) dimethyl chloro silane,(3-phenylpropyl) methyl dichloro silane, N-phenyl aminopropyl trimethoxysilane, N-(triethoxysilyl propyl) dansylamide, N-(3-triethoxysilylpropyl)-4,5-dihydroimidazole, 2-(triethoxysilyl ethyl)-5-(chloroacetoxy)bicycloheptane, (S)—N-triethoxysilyl propyl-O-mentho carbamate,3-(triethoxysilyl propyl)-p-nitrobenzamide, 3-(triethoxysilyl) propylsuccinic anhydride, N-[5-(trimethoxy silyl)-2-aza-1-oxo-pentyl]caprolactam, 2-(trimethoxy silylethyl) pyridine, N-(trimethoxy silyl)benzyl-N,N,N-trimethyl ammonium chloride, phenyl vinyl diethoxy silane,3-thiocyanate propyl triethoxy silane, (tridecafluoro1,1,2,2-tetra-hydro-octyl) triethoxy silane, N-{3-(triethoxy silyl)propyl} phthalamide acid, (3,3,3-trifluoropropyl) methyl dimethoxysilane, (3,3,3-trifluoropropyl) trimethoxy silane, 1-trimethoxysilyl-2-(chloromethyl) phenyl ethane, 2-(trimethoxy silyl) ethyl phenylsulfonyl azide, β-trimethoxy silyl ethyl-2-pyridine, trimethoxy silylpropyl diethylene triamine, N-(3-trimethoxy silyl propyl) pyrrole,N-trimethoxy silylpropyl-N,N,N-tributyl ammonium bromide, N-trimethoxysilylpropyl-N,N,N-tributyl ammonium chloride, N-trimethoxysilylpropyl-N,N,N-trimethyl ammonium chloride, vinylmethyl diethoxysilane, vinyl triethoxy silane, vinyl trimethoxy silane, vinylmethyldimethoxy silane, vinyl dimethyl methoxy silane, vinyl dimethyl ethoxysilane, vinylmethyl dichloro silane, vinylphenyl dichloro silane,vinylphenyl diethoxy silane, vinylphenyl dimethyl silane, vinylphenylmethyl chloro silane, triphenoxy vinyl silane, tris-t-butoxy silane,adamantylethyl trichloro silane, allyl phenyl trichloro silane,(aminoethyl aminomethyl) phenethyl trimethoxy silane, 3-aminophenoxydimethyl vinyl silane, phenyl trichloro silane, phenyl dimethyl chlorosilane, phenylmethyl dichloro silane, benzyl trichloro silane, benzyldimethyl chloro silane, benzyl methyl dichloro silane, phenethyldiisopropyl chloro silane, phenethyl trichloro silane, phenethyldimethyl chloro silane, phenethyl methyl dichloro silane,5-(bicycloheptenyl) trichloro silane, 5-(bicycloheptenyl) triethoxysilane, 2-(bicycloheptyl) dimethyl chloro silane, 2-(bicycloheptyl)trichloro silane, 1,4-bis (trimethoxy silyl ethyl) benzene, bromophenyltrichloro silane, 3-phenoxypropyl dimethyl chloro silane,3-phenoxypropyl trichloro silane, t-butyl phenyl chloro silane, t-butylphenyl methoxy silane, t-butyl phenyl dichloro silane, p-(t-butyl)phenethyl dimethyl chloro silane, p-(t-butyl) phenethyl trichlorosilane, 1,3-(chlorodimethyl silyl methyl) heptacosane, ((chloromethyl)phenyl ethyl) dimethyl chloro silane, ((chloromethyl) phenyl ethyl)methyl dichloro silane, ((chloromethyl) phenylethyl) trichloro silane,((chloromethyl) phenylethyl) trimethoxy silane, chlorophenyl trichlorosilane, 2-cyanoethyl trichloro silane, 2-cyanoethyl methyl dichlorosilane, 3-cyanopropyl methyl diethoxy silane, 3-cyanopropyl methyldichloro silane, 3-cyanopropyl methyl dichloro silane, 3-cyanopropyldimethylethoxy silane, 3-cyanopropyl methyl dichloro silane,3-cyanopropyl trichloro silane, fluorinated alkyl silane, and the like,and it is possible to use one type or a combination of two or more typeswhich are selected from these.

Among these, it is preferable that hexamethyl disilazane is used in thehydrophobic processing. Due to this, it is possible for the particles111 to have higher hydrophobicity. In addition, it is possible for theuniformity of the extent of the hydrophobic processing to be higher foreach of the particles 111 and each portion on the surface of theparticles 111 (including the surfaces inside of the porous holes 1111)in an easy and reliable manner.

In a case where the hydrophobic processing is performed using a silanecompound in a liquid phase, it is possible for a desired reaction toappropriately progress and it is possible to form a silane compoundchemical absorption film by immersing the particles 111, on which thehydrophobic processing is to be carried out, in a liquid which includesa silane compound.

In addition, in a case where the hydrophobic processing is performedusing a silane compound in a gas phase, it is possible for a desiredreaction to appropriately progress and it is possible to form a silanecompound chemical absorption film by exposing the particles 111, onwhich the hydrophobic processing is to be carried out, to the vapors ofa silane compound.

The average particle diameter of the particles 111 which configure thethree dimensional molding powder is not particularly limited but ispreferably 1 μm or more and 25 μm or less and is more preferable 1 μm ormore and 15 μm or less. Due to this, it is possible for the threedimensional mold object 10 to have particularly superior mechanicalstrength, for unintentional irregularities and the like to be moreeffectively prevented from being generated in the three dimensional moldobject 10 which is manufactured, and for the three dimensional moldobject 10 to have particularly superior dimensional precision. Inaddition, it is possible for the three dimensional molding powder tohave particularly superior fluidity and fluidity of the composition (thethree dimensional molding composition) 11 which includes the threedimensional molding powder and it is possible for the three dimensionalmold object 10 to have particularly superior productivity.

The maximum diameter of the particles 111 which configure the threedimensional molding powder is preferably 3 μm or more and 40 μm or lessand is more preferably 5 μm or more and 30 μm or less. Due to this, itis possible for the three dimensional mold object 10 to haveparticularly superior mechanical strength, for unintentionalirregularities and the like to be more effectively prevented from beinggenerated in the three dimensional mold object 10 which is manufactured,and for the three dimensional mold object 10 to have particularlysuperior dimensional precision. In addition, it is possible for thethree dimensional molding powder to have particularly superior fluidityand fluidity of the composition (the three dimensional moldingcomposition) 11 which includes the three dimensional molding powder andit is possible for the three dimensional mold object 10 to haveparticularly superior productivity.

The porosity of the particles 111 which configure the three dimensionalmolding powder is preferably 50% or more and is more preferably 55% ormore and 90% or less. Due to this, it is possible for there to besufficiently spaces (the porous holes 1111) into which the bonding agententers and for the particles 111 to have particularly superiormechanical strength, and as a result, it is possible for the threedimensional mold object 10 to have particularly superior productivitydue to the bonding agent 121 penetrating into the porous holes 1111.Here, the porosity of the particles in the present embodiment refers tothe proportion of the holes which are inside of the particles (in termsof volume) with regard to the apparent volume of the particles and is avalue which is represented by {(ρ₀−ρ)/ρ₀}×100 when the density of theparticles is ρ (g/cm³) and the true density of the configuring materialof the particles is ρ₀ (g/cm³).

The average hole diameter of the particles 111 (the diameter of thepores) is preferable 10 nm or more and is more preferably 50 nm or moreand 300 nm or less. Due to this, it is possible for the threedimensional mold object 10 which is obtained as a final product to haveparticularly superior mechanical strength. In addition, in a case wherethe binding liquid 12 which includes a pigment (a color ink) is used inmanufacturing the three dimensional mold object 10, it is possible forthe pigment to be appropriately held in the porous holes 1111 of theparticles 111. For this reason, it is possible to prevent unintentionaldispersing of the pigment and it is possible to more reliably form highprecision images.

The particles 111 which configure the three dimensional molding powdermay have any shape but preferably have spherical shapes. Due to this, itis possible to have particularly superior fluidity of the threedimensional molding powder and fluidity of the composition (the threedimensional molding composition) 11 which includes the three dimensionalmolding powder and it is possible for the three dimensional mold object10 to have particularly superior productivity, and it is possible forunintentional irregularities and the like to be more effectivelyprevented from being generated in the three dimensional mold object 10which is manufactured and for the three dimensional mold object 10 tohave particularly superior dimensional precision.

The void ratio of the three dimensional molding powder is preferably 70%or more and 98% or less and is more preferably 75% or more and 97.7% orless. Due to this, it is possible for the three dimensional mold object10 to have particularly superior mechanical strength. In addition, it ispossible to have particularly superior fluidity of the three dimensionalmolding powder and fluidity of the composition (the three dimensionalmolding composition) 11 which includes the three dimensional moldingpowder and it is possible for the three dimensional mold object 10 tohave particularly superior productivity, and it is possible to moreeffectively prevent unintentional irregularities and the like beinggenerated in the three dimensional mold object 10 which is manufacturedand for the three dimensional mold object 10 to have particularlysuperior dimensional precision. Here, in a case where the inside of avessel with a predetermined capacity (for example, 100 mL) is filledwith the three dimensional molding powder, the void ratio of the threedimensional molding powder in the present embodiment refers to the ratioof the sum of the volume of the porous holes in all of the particleswhich configure the three dimensional molding powder and the volume ofthe voids which are between the particles with regard to the capacity ofthe vessel and is a value which is represented by {(P₀−P)/P₀}×100 whenthe bulk density of the three dimensional molding powder is P (g/cm³)and the true density of the configuring materials of the threedimensional molding powder is P₀ (g/cm³).

The content ratio of the three dimensional molding powder in thecomposition (the three dimensional molding composition) 11 is preferably10% or more by mass and 90% or less by mass and is more preferably 15%or more by mass and 65% or less by mass. Due to this, it is possible forthe fluidity of the composition (the three dimensional moldingcomposition) 11 to be sufficiently superior and it is possible for thethree dimensional mold object 10 which is obtained as a final product tohave particularly superior mechanical strength.

Water Soluble Resin

The composition 11 may include the water soluble resin 112 along with aplurality of the particles 111. Due to the water soluble resin 112 beingincluded, the particles are bonded (temporary fixed) together inportions of the layer 1 where the binding liquid 12 is not applied(refer to FIG. 8) and it is possible to effectively preventunintentional scattering and the like of the particles 111. Due to this,it is possible to achieve an improvement in the safety of an operatorand dimensional precision of the three dimensional mold object 10 whichis manufactured. Even in a case where the water soluble resin 112 isincluded, the water soluble resin 112 is effectively prevented fromentering into the porous holes 1111 of the particles 111 in a case wherethe hydrophobic processing is carried out on the particles 111. For thisreason, it is possible to reliably exhibit the function of the watersoluble resin 112 which is to temporarily fix together the particles 111and to reliably prevent the problem, where it is not possible to securethe space into which the bonding agent 121 enters, being generated dueto the water soluble resin 112 previously entering into the porous holes1111 of the particles 111.

It is sufficient if at least a portion of the water soluble resin 112 issoluble in water and the solubility with regard to water at 25° C. (theamount which is able to be dissolved in 100 g of water) is preferably,for example, 5 (g/100 g of water) or more and is more preferably 10(g/100 g of water) or more.

As the water soluble resin 112, there are the examples of, for example,synthetic polymers such as random copolymers of polyvinyl alcohol (PVA),polyvinyl pyrrolidone (PVP), polycaprolactam diol, sodium polyacrylate,polyacrylamide, modified polyamide, polyethylene imine, polyethyleneoxide, ethylene oxide, and propylene oxide, natural polymers such ascorn starch, mannan, pectin, agar, alginic acid, dextran, glue, andgelatin, semi-synthetic polymers such as carboxymethyl cellulose,hydroxyethyl cellulose, oxidized starch, and modified starches, and thelike, and it is possible to use one type or a combination of two or moretypes which are selected from these.

As details examples of water soluble resin products, there are theexamples of, for example, methyl cellulose (METOLOSE SM-15 manufacturedby Shin-Etsu Chemical Co., Ltd.), hydroxyethyl cellulose (AL-15manufactured by Fuji Chemical Co., Ltd.), hydroxypropyl cellulose (HPC-Mmanufactured by Nippon Soda Co., Ltd.), carboxymethyl cellulose (CMC-30manufactured by Nichirin Chemical Co., Ltd.), starch phosphate estersodium (I) (HOSTER 5100 manufactured by Matsutani Chemical Industry Co.,Ltd.), polyvinylpyrrolidone (PVP K-90 manufactured by Tokyo ChemicalCo., Ltd.), methyl vinyl ether/maleic anhydride copolymer (GANTREZAN-139 manufactured by GAF Chemical Corp.), polyacrylamide (manufacturedby Wako Pure Chemical Industries Ltd.), modified polyamide (modifiednylon) (AQ nylon manufactured by Toray Industries Inc.), polyethyleneoxide (PEO-1 manufactured by Seitetsu Kagaku Kogyo K.K. and ALKOXmanufactured by Meisei Chemical Works, Ltd.), random copolymer ofethylene oxide and propylene oxide (ALKOX EP manufactured by MeiseiChemical Works, Ltd.), sodium polyacrylate (manufactured by Wako PureChemical Industries Ltd.), carboxy vinyl polymer/cross-linked watersoluble acrylic resin (AQUPEC manufactured by Sumitomo Seika ChemicalsCo., Ltd.), and the like.

Among these, it is possible for the three dimensional mold object 10 tohave particularly superior mechanical strength in a case where the watersoluble resin 112 is a polyvinyl alcohol. In addition, it is possible tomore appropriately control the properties of the water soluble resin 112(for example, solubility in water, water resistance, and the like) andthe properties of the composition 11 (for example, viscosity, force forfixing of the particles 111, wettability, and the like) by adjusting theextent of saponification and polymerization. For this reason, it ispossible to more appropriately correspond to manufacturing of varioustypes of the three dimensional mold object 10. In addition, polyvinylalcohols are cheaper and have a more stable supply among the varioustypes of water soluble resins. For this reason, it is possible toperform stable manufacturing of the three dimensional mold object 10while suppressing production costs.

In a case where the water soluble resin 112 includes polyvinyl alcohol,it is preferable that saponification of the polyvinyl alcohol be 85 ormore and 90 or less. Due to this, it is possible to suppress a reductionin solubility of the polyvinyl alcohol with regard to water. For thisreason, it is possible to more effectively suppress a reduction inadhesiveness between the layers 1 which are adjacent in a case where thecomposition 11 includes water.

In a case where the water soluble resin 112 includes polyvinyl alcohol,it is preferable that polymerization of the polyvinyl alcohol be 300 ormore and 1000 or less. Due to this, it is possible to have particularlysuperior mechanical strength in each of the layers 1 and adhesivenessbetween the layers 1 which are adjacent in a case where the composition11 includes water.

In addition, the following effects are obtained in a case where thewater soluble resin 112 is a polyvinyl pyrrolidone (PVP). That is, sincepolyvinyl pyrrolidone has superior adhesiveness with regard to variousmaterials such as glass, metals, and plastics, it is possible for thelayer 1 where the binding liquid 12 is not applied to have particularlysuperior stability in the strength and shape of portions and for thethree dimensional mold object 10 which is obtained as a final product tohave particularly superior dimensional precision. In addition, sincepolyvinyl pyrrolidone exhibits high solubility with regard to varioustypes of organic solvents, it is possible for the composition 11 to haveparticularly superior fluidity in a case where the composition 11includes an organic solvent, it is possible to appropriately form thelayer 1 where unintentional variation in the thickness is moreeffectively prevented, and it is possible for the three dimensional moldobject 10 which is obtained as a final product to have particularlysuperior dimensional precision. In addition, since polyvinyl pyrrolidoneexhibits high solubility with regard to water, it is possible to easilyand reliably remove the particles 111 which are not bonded using thebonding agent 121 out of the particles 111 which configure each of thelayers 1 in the unbonded particles removing process (after manufacturingis complete). In addition, since polyvinyl pyrrolidone has appropriateaffinity with the three dimensional molding powder, wettability withregard to the surface of the particles 111 is comparatively high while,on the other hand, it is sufficiently difficult for entering into theporous holes 1111 to occur as described above. For this reason, it ispossible to more effectively exhibit the function of temporary fixing asdescribed above. In addition, since polyvinyl pyrrolidone has superioraffinity with regard to various types of coloring agents, it is possibleto effectively prevent unintentional spreading of the coloring agent ina case where the binding liquid 12 which includes a coloring agent isused in the binding liquid applying process. In addition, sincepolyvinyl pyrrolidone has an anti-static function, it is possible toeffectively prevent scattering of the particles in a case where theparticles which are not in a paste are used as the composition 11 in thelayer forming process. In addition, if the composition 11 in a pasteform includes polyvinyl pyrrolidone in a case where the composition 11is used as a paste in the layer forming process, it is possible toeffectively prevent foam being mixed into the composition 11 and it ispossible to more effectively prevent defects due to the foam being mixedin being generated in the layer forming process.

In a case where the water soluble resin 112 includes polyvinylpyrrolidone, the weight average molecular weight of the polyvinylpyrrolidone is preferably 10000 or more and 1700000 or less and ispreferably 30000 or more and 1500000 or less. Due to this, it ispossible to more effectively exhibit the function described above.

In addition, in a case where the water soluble resin 112 includespolycaprolactam diol, it is possible for the composition 11 to be inappropriate pellet shapes, it is possible to more effectively preventunintentional scattering of the particles 111 and the like, and it ispossible to improve the handling (ease of handling) of the composition11 and achieve an improvement in safety of the operator and dimensionalprecision of the three dimensional mold object 10 which is manufactured,and it is possible to suppress energy costs which are necessary in theproduction of the three dimensional mold object 10 and it is possiblefor the three dimensional mold object 10 to have sufficiently superiorproductivity since melting at a relatively low temperature is possible.

In a case where the water soluble resin 112 includes polycaprolactamdiol, the weight average molecular weight of the polycaprolactam diol ispreferably 10000 or more and 1700000 or less and is preferably 30000 ormore and 1500000 or less. Due to this, it is possible to moreeffectively exhibit the function described above.

It is preferable that the water soluble resin 112 in the composition 11be in a liquid phase state (for example, a dissolved state, a meltedstate, or the like) in at least the layer forming process. Due to this,it is possible for the uniformity of the thickness of the layers 1 whichare formed using the composition 11 to be higher in an easy and reliablemanner.

Solvent

The composition 11 may include a volatile solvent in addition to thecomponents described above. Due to this, it is possible to particularlysuperior fluidity of the composition 11 and for the three dimensionalmold object 10 to have particularly superior productivity.

It is preferable that the water soluble resin 112 be dissolved in thesolvent. Due to this, it is possible for the composition 11 to havefavorable fluidity and it is possible more effectively preventunintentional variation in the thickness of the layers 1 which areformed using the composition 11. In addition, it is possible for thewater soluble resin 112 to be attached to the particles 111 with higheruniformity over the entirety of the layer 1 when the layer 1 is formedin a state where the solvent is removed and it is possible to moreeffectively prevent unintentional unevenness in the composition beinggenerated. For this reason, it is possible to more effectively preventunintentional variation in mechanical strength being generated at eachportion of the three dimensional mold object 10 which is obtained as aresult and it is possible for the three dimensional mold object 10 tohave higher reliability.

As the solvent which configures the composition 11, there are theexamples of, for example, water, alcoholic solvents such as methanol,ethanol, and isopropanol, ketone solvents such as methyl ethyl ketoneand acetone, glycol ether solvents such as ethylene glycol monoethylether and ethylene glycol monobutyl ether, glycol ether acetate solventssuch as propylene glycol 1-monomethyl ether 2-acetate and propyleneglycol 1-monomethyl ether 2-acetate, polyethylene glycol, polypropyleneglycol, and the like, and it is possible to use one type or acombination of two or more types which are selected from these.

Among these, it is preferable that the composition 11 includes water.Due to this, it is possible for the water soluble resin 112 to be morereliably dissolved and it is possible to have particularly superiorfluidity of the composition 11 and uniformity of the composition in thelayers 1 which are formed using the composition 11. In addition,removing of water after forming the layer 1 is easy and it is difficultfor there to be adverse effects even in a case where water remains inthe three dimensional mold object 10. In addition, it is effective fromthe points of view of safety for people, environmental issues, and thelike.

The content ratio of the solvent in the composition 11 in a case wherethe composition 11 includes the solvent is preferably 5% or more by massand 75% or less by mass and more preferably 35% or more by mass and 70%or less by mass. Due to this, since the effects from including thesolvent as described above are more remarkably exhibited and it ispossible for the solvent to be easily removed in a short period of timein the process of manufacturing the three dimensional mold object 10, itis effective from the point of view of improving productivity of thethree dimensional mold object 10.

In particular, the content ratio of water in the composition 11 in acase where the composition 11 includes water as the solvent ispreferably 20% or more by mass and 73% or less by mass and morepreferably 50% or more by mass and 70% or less by mass. Due to this, theeffects as described above are more remarkably exhibited.

Other Compounds

In addition, the composition 11 may include compounds other than thecompounds described above. As the other compounds, there are theexamples of, for example, a polymerization initiator, a polymerizationaccelerator, a penetration enhancing agent, a wetting agent (amoisturizing agent), a fixing agent, an antimold agent, a preservingagent, an antioxidizing agent, an ultraviolet absorbing agent, achelating agent, a pH adjusting agent, and the like.

Three Dimensional Mold Object

It is possible for the three dimensional mold object of the presentembodiment to be manufactured using the method of manufacturing and thethree dimensional mold object manufacturing apparatus described above.Due to this, it is possible to provide the three dimensional mold objectwith superior dimensional precision where defects are effectivelyprevented from being generated.

The applications of the three dimensional mold object of the presentembodiment are not particularly limited, but there are the examples of,for example, ornaments or exhibits such as figurines, medical devicessuch as implants, and the like.

In addition, the three dimensional mold object of the present embodimentmay be applied to any of prototypes, mass production, or made-to-orderproducts.

The embodiments of the present embodiment are described above, but thepresent embodiment is not limited to this.

For example, a roller or the like may be used as the planarizing unitinstead of the squeegee as described above.

In addition, the three dimensional mold object manufacturing apparatusmay be provided with a recovery mechanism which is not shown in thediagrams for recovering the composition which is not used in forming thelayers out of the composition which is supplied from the compositionsupplying section. Due to this, since it is possible to supply thecomposition in a sufficient amount while preventing surplus compositionaccumulating in the layer forming section, it is possible to more stablymanufacture the three dimensional mold object while more effectivelypreventing defects being generated in the layers. In addition, since itis possible to use the composition which is recovered again inmanufacturing the three dimensional mold object, it is possible tocontribute to a reduction in manufacturing costs of the threedimensional mold object and, in addition, it is preferable from thepoint of view of saving resources.

In addition, the three dimensional mold object manufacturing apparatusof the present embodiment may be provided with a recovery mechanism forrecovering the composition which is removed in the unbonded particlesremoving process.

In addition, it is described in the configuration which is shown in FIG.3 to FIG. 6 that the light emitting section which configures the bulgedetecting unit emits light for detecting the bulges in the Y axisdirection, but the direction for emitting light for detecting the bulgeis not particularly limited and may be, for example, the X axisdirection. In addition, there may be a configuration where, for example,light for detecting the bulges is emitted in each of the X axisdirection and the Y axis direction. Due to this, it is possible toeasily and reliably determine the accurate coordinates of the bulges.

In addition, the bulge detecting unit in the present embodiment may beany means as long as there is a function for detecting the height of thebulge and need not be the means which is described in the embodimentdescribed above. In particular, the bulge detecting unit in theembodiment described above is described as a representative in a casewhere the bulges are detected using a noncontact method (in particular,an optical method), but the bulge detecting unit in the presentembodiment may be any means as long as it is possible to detect thebulges.

In addition, it is described that the bonded sections are formed withregard to all of the layers in the embodiments described above, butthere may be layers where the bonded section is not formed. For example,the layer which is formed directly on the stage so that the bondedsection is not formed may function as a sacrificial layer.

In addition, the binding liquid applying process in the embodimentsdescribed above is described centered on a case of being performed usingan ink jet system, but the binding liquid applying process may beperformed using another method (for example, another printing method).

In addition, in the manufacturing method of the present embodiment, itis sufficient if the scanning process is performed on at least a portionof the layers out of the plurality of layers which configure the threedimensional mold object and the scanning process need not be performedwith regard to all of the layers.

In addition, it is described in the embodiment described above that, inaddition to the layer forming process and the binding liquid applyingprocess, the curing process is also repeatedly performed in combinationwith the layer forming process and the binding liquid applying process,but the curing process need not be repeatedly performed. For example,the curing process may be performed all together after the layered body,which is provided with a plurality of layers which are not cured, isformed.

In addition, it is described in the embodiment described above that thescanning process is performed with regard to the layer after the bindingliquid applying process and the bonding process are performed, but thescanning process may be performed at any timing as long as it is afterthe first layer forming process and before the second layer formingprocess.

In addition, a pre-processing process, an intermediate processingprocess, and a post-processing process may be performed in themanufacturing method of the present embodiment according torequirements.

As the pre-processing process, there are the examples of, for example, astage cleaning process or the like.

As the intermediate processing process, there may be a process where,for example, heating is stopped or the like (a water soluble resinsolidifying process) between the layer forming process and the bindingliquid applying process in a case where the three dimensional moldingcomposition is in pellet form. Due to this, the water soluble resin isin a solid state and it is possible for the layers to obtain a strongerforce for bonding the particles together. In addition, there may be asolvent component removing process where, for example, in a case wherethe three dimensional molding composition includes a solvent component(dispersing agent) such as water, the solvent component is removedbetween the layer forming process and the binding liquid applyingprocess. Due to this, it is possible to more smoothly perform the layerforming process and it is possible to more effectively preventunintentional variation in the thickness of the layers which are formed.As a result, it is possible for the three dimensional mold object withhigher dimensional precision to be manufactured with higherproductivity.

As the post-processing process, there are the examples of, for example,a washing process, a shape adjusting process where trimming isperformed, a coloring process, a cover layer forming process, a bondingagent curing completion process where light irradiation processing orheat processing is performed in order to reliably cure the bonding agentwhich is not cured, and the like.

In addition, there is description of the embodiments described abovecentered on the method which has the binding liquid applying process andthe curing process (the bonding process), but it is not necessary toprovide the curing process (the bonding process) after the bindingliquid applying process in a case where the binding liquid includes athermoplastic resin as the bonding agent (and it is possible for thebinding liquid applying process to be carried out together with thebonding process). In addition, the three dimensional mold objectmanufacturing apparatus need not be provided with the energy rayirradiating unit (the curing unit) in this case.

In addition, it is described in the embodiments described above thatscanning is performed in order to perform detecting of the bulges on thewhole outer surface of the layer, but the scanning may be performed withregard to only a region which is a portion of the layer. For example, ina case where the bulge is in a region, which is outside of a region(molding area) where a solid section is formed in the layer, and whichis a region where there is a possibility that there is the bulge and thebulge will move due to planarizing using the planarizing unit, scanningfor performing detecting of the bulges need not be performed for thisregion in a case where there is no possibility that the bulge will movein the molding area. In addition, in a case where scanning is performedfor performing detecting of the bulges for this region (in the samemanner as for other regions) and the bulge with a height which is equalto or higher than the predetermined height is not detected in the otherregions, adjusting of the thickness of the layer (the second layer) neednot be performed irrespective of whether or not the bulge is detected ornot in this region.

A three dimensional mold object manufacturing apparatus is adapted tomanufacture a three dimensional mold object by repeatedly forming andlayering layers using a composition including particles. The threedimensional mold object manufacturing apparatus includes a layer formingsection and a bulge detecting unit. The layer forming section isconfigured and arranged to form the layers using the composition. Thebulge detecting unit is configured and arranged to detect a bulge on thelayers. When the bulge detecting unit detects the bulge with a heightequal to or more than a predetermined height formed on one of thelayers, the layer forming section is configured and arranged to adjust athickness of a subsequent one of the layers, which is provided directlyon the one of the layers where the bulge is detected.

Due to this, it is possible to provide the three dimensional mold objectmanufacturing apparatus where it is possible to effectively manufacturea three dimensional mold object with superior dimensional precisionwhere defects are effectively prevented from being generated.

In the three dimensional mold object manufacturing apparatus of theaspect, the layer forming section preferably has a raising and loweringstage and a planarizing unit configured and arranged to be relativelymoved with respect to the raising and lowering stage and to planarizethe composition which is applied to form the layers, and the layerforming section is preferably configured and arranged to adjust thethickness of the subsequent one of the layers by adjusting a loweringamount of the raising and lowering stage.

Due to this, it is possible to more easily and suitably adjust thethickness of the layer which is provided directly on the layer where thebulge with a height, which is equal to or more than a predeterminedheight, is detected.

In the three dimensional mold object manufacturing apparatus of theaspect, the layer forming section is preferably configured and arrangedto form the subsequent one of the layers with a standard thickness whenthe bulge detecting unit does not detect the bulge on the one of thelayers with the height equal to or more than the predetermined height,and the layer forming section is preferably configured to form thesubsequent one of the layers with a thickness where a value, which isdetermined based on a largest height out of heights of bulges, is addedto the standard thickness when the bulge detecting unit detects one ormore of the bulges with the height equal to or more than thepredetermined height.

Due to this, it is possible to more effectively prevent defects frombeing generated in the three dimensional mold object which ismanufactured and it is possible for the three dimensional mold object tohave particularly superior dimensional precision.

In the three dimensional mold object manufacturing apparatus of theaspect, when the largest height out of the heights of the bulges is Y(μm), the layer forming section is preferably configured and arranged todetermine the thickness of the subsequent one of the layers in a rangewhich is 1.05 Y or more and 1.5 Y or less when the bulge detecting unitdetects one or more of the bulges with the height equal to or more thanthe predetermined height.

Due to this, it is possible to more effectively prevent defects frombeing generated in the three dimensional mold object which ismanufactured and it is possible for the three dimensional mold object tohave further superior dimensional precision.

The three dimensional mold object manufacturing apparatus of the aspectpreferably further includes a binding liquid applying unit configuredand arranged to apply binding liquid for bonding the particles.

Due to this, it is possible to apply the binding liquid with a finepattern and it is possible for the three dimensional mold object to haveparticularly productive manufacturing even with the three dimensionalmold object which has a fine structure.

In the three dimensional mold object manufacturing apparatus of theaspect, the binding liquid applying unit is preferably configured andarranged to adjust a discharge amount of the binding liquid based on thethickness of the subsequent one of the layers where the thickness isadjusted due to detecting of the bulge.

Due to this, it is possible to apply the binding liquid in an amountwhich is necessarily sufficient, it is possible to reliably form abonded section in the desired pattern, and it is possible for the threedimensional mold object to have more reliably superior dimensionalprecision and mechanical strength. In addition, it is possible toreliably obtain the desired color tone in a case where a coloring agentis included in the binding liquid and it is possible to reliably preventunintentional changes in color tone and unintentional breakdown of thecolor balance in accompaniment with changes in the thickness of thelayer.

In the three dimensional mold object manufacturing apparatus of theaspect, the composition preferably includes a volatile solvent and awater soluble resin in addition to the particles.

Due to this, the particles are bonded (temporary fixed) together inportions of the layer where the binding liquid is not applied, it ispossible to effectively prevent unintentional scattering and the like ofthe particles, and it is possible to achieve an improvement in thesafety of an operator and dimensional precision of the three dimensionalmold object which is manufactured. In addition, it is possible for thecomposition to have particularly superior fluidity and it is possiblefor the three dimensional mold object to have particularly superiorproductivity.

The three dimensional mold object manufacturing apparatus of the aspectpreferably includes an energy ray irradiating unit configured andarranged to irradiate energy rays for fusing the particles.

In an apparatus which has a configuration where the particles are fusedusing energy rays in the prior art, it is particularly easy forunintentional bulges to be formed and it is difficult to obtain thethree dimensional mold object with superior dimensional precision wheredefects are effectively prevented from being generated. In addition, inan apparatus which has a configuration where the particles are fusedusing energy rays in the prior art, removing the bulge is considered,but productivity of the three dimensional mold object is remarkablereduced in this case. In addition, the bulges which are generated inthis apparatus are often fused (sintered) due to irradiating of energyrays and it is easy for defects to be generated in the bonded sectionwhich accompanies removing the bulges since a relatively large force isnecessary for removing the bulges. In contrast to this, it is possibleto effectively prevent the problems described above from being generatedin the aspect even in a case where forming of the bonded section isperformed by fusing the particles due to irradiating of energy rays.That is, the effects of the aspect are more remarkable exhibited in acase where forming of the bonded section is performed by fusing theparticles due to irradiating of energy rays.

In the three dimensional mold object manufacturing apparatus of theaspect, the energy ray irradiating unit is preferably configured andarranged to adjust output of the energy rays based on the thickness ofthe subsequent one of the layers where the thickness is adjusted due todetecting of the bulge.

Due to this, it is possible to irradiate the energy rays with an energyamount which is necessarily sufficient, it is possible to more reliablyform the bonded section in the desired pattern, and it is possible forthe three dimensional mold object to have more reliably superiordimensional precision and mechanical strength.

In the three dimensional mold object manufacturing apparatus of theaspect, the bulge detecting section preferably has a sensor configuredand arranged to be relatively moved with respect to the layers.

Due to this, it is possible to appropriately adopt a line sensor whichhas higher resolution and it is possible to determine the height of thebulge more accurately in a case where there are bulges on the layer.

In the three dimensional mold object manufacturing apparatus of theaspect, the bulge detecting section preferably has a sensor which isarranged so as to not relatively move with respect to the layers.

Due to this, since it is possible to check the presence or absence ofthe bulge with a height which is equal to or higher than thepredetermined height across the entire surface of the layer withoutmoving the bulge detecting unit (a light emitting section and a lightreceiving section), it is possible to shorten the time which isnecessary for checking and it is possible for the three dimensional moldobject to have particularly superior productivity.

In the three dimensional mold object manufacturing apparatus of theaspect, it is preferable that the bulge detecting unit is preferablyconfigured and arranged to determine the height of the bulge bydetermining a focal point distance from above a main surface of the oneof the layers.

Due to this, since it is possible to check the presence or absence ofthe bulge with a height which is equal to or higher than thepredetermined height across the entire surface of the layer withoutmoving the bulge detecting unit, it is possible to shorten the timewhich is necessary for scanning to check for the presence or absence ofthe bulge with a height which is equal to or higher than thepredetermined height and it is possible for the three dimensional moldobject to have particularly superior productivity. In addition, it ispossible to determine not only the height of the bulge but accuratecoordinates of the bulge in the XY plane.

A method for manufacturing a three dimensional mold object according toanother aspect includes manufacturing the three dimensional mold objectusing the three dimensional mold object manufacturing apparatusaccording to the aspect described above.

Due to this, it is possible to provide the method for manufacturing athree dimensional mold object where it is possible to effectivelymanufacture a three dimensional mold object with superior dimensionalprecision where defects are effectively prevented from being generated.

A method for manufacturing a three dimensional mold object according toanother aspect includes: forming a first layer using a compositionincluding particles; checking presence or absence of a bulge with aheight equal to or higher than a predetermined height on the first layerafter the forming of the first layer; and forming a second layer usingthe composition including the particles directly on the first layerafter the checking of the presence or absence of the bulge on the firstlayer. The forming of the second layer including adjusting a thicknessof the second layer when the bulge with the height equal to or higherthan the predetermined height is detected.

Due to this, it is possible to provide the method for manufacturing athree dimensional mold object where it is possible to effectivelymanufacture a three dimensional mold object with superior dimensionalprecision where defects are effectively prevented from being generated.

A three dimensional mold object of another aspect is manufactured usingthe three dimensional mold object manufacturing apparatus of the aspectdescribed above.

Due to this, it is possible to provide the three dimensional mold objectwith superior dimensional precision where defects are effectivelyprevented from being generated.

GENERAL INTERPRETATION OF TERMS

In understanding the scope of the present invention, the term“comprising” and its derivatives, as used herein, are intended to beopen ended terms that specify the presence of the stated features,elements, components, groups, integers, and/or steps, but do not excludethe presence of other unstated features, elements, components, groups,integers and/or steps. The foregoing also applies to words havingsimilar meanings such as the terms, “including”, “having” and theirderivatives. Also, the terms “part,” “section,” “portion,” “member” or“element” when used in the singular can have the dual meaning of asingle part or a plurality of parts. Finally, terms of degree such as“substantially”, “about” and “approximately” as used herein mean areasonable amount of deviation of the modified term such that the endresult is not significantly changed. For example, these terms can beconstrued as including a deviation of at least ±5% of the modified termif this deviation would not negate the meaning of the word it modifies.

While only selected embodiments have been chosen to illustrate thepresent invention, it will be apparent to those skilled in the art fromthis disclosure that various changes and modifications can be madeherein without departing from the scope of the invention as defined inthe appended claims. Furthermore, the foregoing descriptions of theembodiments according to the present invention are provided forillustration only, and not for the purpose of limiting the invention asdefined by the appended claims and their equivalents.

What is claimed is:
 1. A three dimensional mold object manufacturingapparatus adapted to manufacture a three dimensional mold object byrepeatedly forming and layering layers using a composition includingparticles, the three dimensional mold object manufacturing apparatuscomprising: a layer forming section configured and arranged to form thelayers using the composition; a binding liquid applying unit configuredand arranged to apply binding liquid for bonding the particles; aninfrared ray irradiating unit configured and arranged to cure thebinding liquid; and a bulge detecting unit configured and arranged todetect a presence or absence of a bulge on the layers, the layer formingsection and the infrared ray irradiating unit being configured andarranged to move in the same direction, and in response to the bulgedetecting unit detecting the presence of the bulge with a height equalto or more than a predetermined height formed on one of the layers, thelayer forming section being configured and arranged to adjust athickness of a subsequent one of the layers, which is provided directlyon the one of the layers where the bulge is detected, in response to thebulge detecting unit detecting the absence of the bulge with the heightequal to or more than the predetermined height formed on the one of thelayers, the layer forming section being configured and arranged not toadjust the thickness of the subsequent one of the layers, and configuredand arranged to form the subsequent one of the layers with a thicknessthat is equal to that of the one of the layers.
 2. The three dimensionalmold object manufacturing apparatus according to claim 1, wherein thelayer forming section has a raising and lowering stage and a planarizingunit configured and arranged to be relatively moved with respect to theraising and lowering stage and to planarize the composition which isapplied to form the layers, and the layer forming section is configuredand arranged to adjust the thickness of the subsequent one of the layersby adjusting a lowering amount of the raising and lowering stage.
 3. Thethree dimensional mold object manufacturing apparatus according to claim1, wherein the layer forming section is configured to form thesubsequent one of the layers with a thickness where a value, which isdetermined based on a largest height out of heights of bulges, is addedto the standard thickness when the bulge detecting unit detects one ormore of the bulges with the height equal to or more than thepredetermined height.
 4. The three dimensional mold object manufacturingapparatus according to claim 1, wherein when the largest height out ofthe heights of the bulges is Y (μm), the layer forming section isconfigured and arranged to determine the thickness of the subsequent oneof the layers in a range which is 1.05×Y or more and 1.5×Y or less whenthe bulge detecting unit detects one or more of the bulges with theheight equal to or more than the predetermined height.
 5. The threedimensional mold object manufacturing apparatus according to claim 1,wherein the binding liquid applying unit is configured and arranged toadjust a discharge amount of the binding liquid based on the thicknessof the subsequent one of the layers where the thickness is adjusted dueto detecting of the bulge.
 6. The three dimensional mold objectmanufacturing apparatus according to claim 1, wherein the compositionincludes a volatile solvent and a water soluble resin in addition to theparticles.
 7. The three dimensional mold object manufacturing apparatusaccording to claim 1, wherein the infrared ray irradiating unit isconfigured and arranged to adjust output of the infrared rays based onthe thickness of the subsequent one of the layers where the thickness isadjusted due to detecting of the bulge.
 8. The three dimensional moldobject manufacturing apparatus according to claim 1, wherein the bulgedetecting section has a sensor configured and arranged to be relativelymoved with respect to the layers.
 9. The three dimensional mold objectmanufacturing apparatus according to claim 1, wherein the bulgedetecting section has a sensor which is arranged so as to not relativelymove with respect to the layers.
 10. The three dimensional mold objectmanufacturing apparatus according to claim 1, wherein the bulgedetecting unit is configured and arranged to determine the height of thebulge by determining a focal point distance from above a main surface ofthe one of the layers.